Electronics Forum | Fri Feb 21 19:49:10 EST 2003 | neil
There are a number of companies who have used traditional screen printing to depsosit standard and conductive adhesive.
Electronics Forum | Thu Jul 12 10:23:30 EDT 2012 | blnorman
Check with your adhesive manufacturer. In a previous life we had one line that was either double sided reflow or wave following reflow. When it was ds reflow, we just shut off the wave. When it was reflow/wave, we kept the reflow oven on with the
Electronics Forum | Thu Feb 24 10:34:02 EST 2005 | Rob
Thanks Dave, From what I remember a lot of components went away from Silver Palladium to "base metal" terminations because of the difficulties in continuation of supply & stability of price. (Something about being mined in Chechnia or the Congo?) W
Electronics Forum | Mon Dec 20 19:09:54 EST 1999 | Chris
If your flex circuit is only populated on one side, you can have the PCB vendor palletize the flex for you. What you do is have the flex circuit laminated to 062" FR4 using a thermoset adhesive like Dupont WA. Standard flex circuit adhesive. Howev
Electronics Forum | Tue Mar 13 18:25:45 EST 2001 | slthomas
Anyone doing a print-dispense-place-reflow process? I've never heard of it being done this way before today. Don't know why, actually, as it sounds like a fairly friendly method provided the adhesives used are happy with a standard reflow profile.
Electronics Forum | Mon Aug 27 11:01:05 EDT 2001 | lloyd
Hi, I'm currently looking into changing our current supplier of SMD adhesive. My problem is how to effectivly evaluate any new samples I recieve. I'ved looked through the IPC standards and understand the concepts in testing them, but in practical te
Electronics Forum | Tue Jan 06 04:37:21 EST 2009 | janz
Tack test - follow IPC standard TM650 #2.4.44. Regards Janz
Electronics Forum | Fri Feb 16 09:30:38 EST 2007 | DEK Answer Guy
Hello PR, PumpPrint� technologies enable high throughput adhesive deposition using a screen printing platform. Careful selection of stencil material, and informed study of the design of apertures and other stencil features, enables a wide range of
Electronics Forum | Thu Apr 16 11:50:24 EDT 1998 | Gary Simbulan
| O.K., somebody read a probably hand-written 3 as 8. | Under these numbers, I can find at IBM's Patent Server the following other topics: | USP 4,312,692 | http://www.patents.ibm.com/details?patent_number=4312692: | USP 4,314,870 | http://www.pat
Electronics Forum | Mon Sep 10 02:47:27 EDT 2001 | Peter W.
Thank you for your annotaions. I am aware of the limits and temperatures of that material, but we are doing some research with thermoplastic base materials which won't survive standard solder paste reflow soldering. And beside of using conductive ad
