Electronics Forum | Wed Oct 01 04:43:36 EDT 2008 | omid_juve
we need a soldering nozzle for this package that can be placed by the rework machine on a pads of this qfp (to make the pads planar) and then send a hot air and after the solder joint melt stop the hot air and pull up the nozzle do we have such mach
Electronics Forum | Fri Jan 22 14:31:14 EST 1999 | Dave F
| I have boards coated with Humiseal 1B73. At a late point mfg. site we need to remove a series of 0603 resistors for optioning purposes. I have been trying to determine the fastest, easiest way to re-coat the pads after removal. Drying time of the c
Electronics Forum | Tue Aug 30 10:01:55 EDT 2005 | slthomas
I haven't used that Loctite before as I've never printed adhesive, but you might try reheating the part with a hot air tool...it works pretty well with 3609.
Electronics Forum | Fri Jul 20 08:16:48 EDT 2007 | hussman
Wow, I've never heard of this. If it voids during cure you either have a hot profile or bad adhesive. We use Loctite Chip Bonder. No problems.
Electronics Forum | Tue Nov 16 14:10:30 EST 1999 | Bill Schreiber
According to a paper by Richard Clouthier, published in 1996, there are two major factors about normal cleaning chemistries that may affect stencil adhesives. 1) Elevated temperature above 110 degrees F. (45 degrees C). Stencil adhesives are heat c
Electronics Forum | Tue Oct 03 15:28:24 EDT 2006 | realchunks
No adhesive? Then how about 2 different solder pastes? Higher melting temp for the first side, lower for the second.
Electronics Forum | Thu Jul 12 10:23:30 EDT 2012 | blnorman
Check with your adhesive manufacturer. In a previous life we had one line that was either double sided reflow or wave following reflow. When it was ds reflow, we just shut off the wave. When it was reflow/wave, we kept the reflow oven on with the
Electronics Forum | Wed May 25 12:29:39 EDT 2005 | chunks
Hi Dave, How/why is the 3M better? Sounds like you did some research and was wondering if reg. ol' hot melt might cause some other problems to the board. I bet the 3M costs a bit more too.
Electronics Forum | Mon Oct 31 13:37:51 EST 2005 | slthomas
I would second the hot melt glue method. You do have to teach the importance of "more is not always better" and there will be learning curve, but it's a lot better at securing big clunky electrolytics than RTV. It's also a lot cheaper than chipbonder
Electronics Forum | Fri Mar 05 04:19:03 EST 2010 | aungthura
Ya, that could be happened bcoz of reflow profile.I think, in this case, each lead got the different temperature during the reflow process. If the solder had melted properly,the hot lead would have attracted the solder to cover itself.
