Electronics Forum | Mon Jan 19 20:01:11 EST 1998 | Steve Gregory
| We use no clean paste and sometimes experience | flux splattering which gives spot on gold fingers. | Need help in analize the cause. thx. Dominic, That is STILL a problem huh? It's a tough one to solve sometimes...especially when you have as
Electronics Forum | Thu Jan 18 21:52:24 EST 2001 | arul2000
>>>>Dave, The BGA substrate surface finish is NiAu, while the PCBA pad surface is HASL. The solder ball composition is SnPb 63/37 and the solder paste used on the PCBA is also the same but with 2% Silver.>>> Dave, sorry I don't have the picture with
Electronics Forum | Fri Aug 13 09:51:25 EDT 1999 | Dave F
| Ladies and Gentlemen, | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav tremendous
Electronics Forum | Wed Apr 21 22:15:12 EDT 1999 | Chris
| I'm having problems with trying to get a good solder joint using a Ceramic PCB. We are using AMTECH hi-temp solder (ws-486 96.5/3.5ag). My profile looks great and I used the recommended profile from Amtech with a few adjustments. My max temp is abo
Electronics Forum | Thu Jul 20 23:41:55 EDT 2017 | heros_electronics
Below is an email that I copy and pasted from my customer's engineer about his concerns with the issue of the chips not reflowing (which is why I was asking about X-ray the chips to make sure they reflowed): Can you let me know your thoughts on his
Electronics Forum | Mon Nov 02 22:57:02 EST 1998 | Kelly Gossman
Micheal, What does your profile look like for the wave? What profile does your flux say you need? My guess is it is not your profile, our testing with solder balls found that the mask on the boards was the largest contributor to solder balls. Wha
Electronics Forum | Thu Sep 17 10:45:27 EDT 1998 | Justin Medernach
| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material
Electronics Forum | Wed May 16 15:40:56 EDT 2012 | davef
Here's some notes from a Bob Willis presentation Assembly of Flexible Circuits with Lead-Free Solder Alloy [Bob Willis leadfreesoldering.com] * Flexible Circuit Construction ** Base Material - 0.05mm Copper 18/18 um ESPANEX from Holders Technologies
Electronics Forum | Fri Jun 02 17:33:51 EDT 2000 | Dave F
Hey CK, we�re all sodder googoo�s ... wanna be gurus Why donchu tell �em not to put sodder in your vias? Er, makit so the sodder won�t flow out of the bottom of the vias and cause dem stalactites? OK OK, here�s wacha do, modify the second side ste
Electronics Forum | Sun Aug 08 04:36:02 EDT 1999 | Brian
Dave Frankly, I think you may be barking up the wrong tree. Like DaveF, I suggest that the process would be horrendously expensive with masking and so on. The $64,000 question is whether what you propose will serve any useful purpose. I venture to
