Electronics Forum | Wed Aug 26 05:13:01 EDT 2009 | grahamcooper22
Hi, as you are using Vapour phase reflow what temperature is the boiling point of the solvent you are using ? If it is @ 250 C then you should be getting everything hot enough to melt the ball and solder paste together. If this is the case then your
Electronics Forum | Thu Jan 26 13:13:14 EST 2017 | dyoungquist
What type of solder are you using, Lead or Lead-Free? What is the melting point of it? What temperature are you setting your solder bath to? Possible solutions: 1) Give your solder bath a little more time to even out the temperature across the en
Electronics Forum | Wed May 04 10:27:33 EDT 2005 | nice90
Or you can use the Hot Air (Hakko) to remove that component and a tweezer to pull it. dont pull it just yet. If you see the solder melting then feel the component using the tweezer by wiggling it a bit and if you can wiggle it only then you can pull
Electronics Forum | Thu Jul 06 07:30:46 EDT 2000 | John
Ralph, Typically our co-op students put down solder paste with a syringe, place the parts on the paste with tweezers, and then reflow the paste with a hot air pencil. This works pretty well when they are hand building prototypes. You can probably
Electronics Forum | Tue Jul 11 10:10:55 EDT 2000 | John Thorup
Low static Kapton dots are available from Shercon (www.shercon.com) and through many distributors like com-kyl. Purpose specific dots are available from Circuit Technology Center as TD-250 Tape Dots. (www.circuittechcenter.com). Consider also The Pr
Electronics Forum | Mon Nov 12 16:10:46 EST 2001 | davef
There is no doubt that we reflowed topside BGA on our wave solder machine. We run our wave pot at 450�F and that�s plenty hot enough to reflow solder on topside SMT components. When the solder balls on the BGA melt, the package is over 200�C, trust
Electronics Forum | Wed Apr 14 07:59:54 EDT 2004 | arcandspark
Makes a lot of sense, thanks for the excellent input. The peak temp I am running fo our pb free (238C and approx. 90 seconds above 183 C)is the recommended profile from T.I and also the solder paste manufacture. Not sure exactly what the melting temp
Electronics Forum | Wed Jun 15 13:47:28 EDT 2005 | russ
No you're not stupid, they will melt if the top of the board gets real hot. I was lucky most likely in that ours were usually off of the board surface. anything that will hold the weight material will work. Now that I think about it my shot bags w
Electronics Forum | Thu Jun 23 14:13:52 EDT 2005 | Frank
Luckily I haven't needed to do very many bottom side BGA placements. But I have also heard of trying to use a higher temp solder for bottom side only and your normal solder for the top side. This way the bottom side solder doesn't get hot enough to
Electronics Forum | Wed Oct 12 13:53:03 EDT 2005 | russ
What is nihon solder and which SAC alloy? Try using hot air to preheat the board to about 150C if you can, then try to remove the solder. Sucking pbfree from holes is very difficult since you have to achieve the alloys melting point throughout the
