Electronics Forum | Fri Nov 30 15:23:03 EST 2007 | jdumont
The hot melt is prob the only way to go for that size gap. If you could decrease that gap I would suggest using 3M Scotchweld DP100FR. Check it out. We use the duo pak cartridges and mix nozzles with the gun. Very simple use and works great in our ES
Electronics Forum | Tue Jan 08 18:24:32 EST 2008 | jmelson
If your wedding ring ever gets hot enough to melt solder, I sure hope your finger isn't in it at the time! On the original question, most stainless alloys have quite a bit of Nickel in them, so going to stainless will not ELIMINATE nickel, although
Electronics Forum | Tue Aug 25 07:13:20 EDT 2009 | davef
It sounds like the BGA balls are not melting. You're probably getting no collapse. Put a bare BGA on a hot plate. Heat it up until you get collapse. Adjust your reflow profile until you have that temperature on the BGA pads on the board. What is the
Electronics Forum | Fri Jan 30 06:14:01 EST 2015 | philc
And there is always the argument of "get in and out quick", which is possible with high tip temps. I prefer to use a really hot iron, and do it quickly, rather than a lower temps and keep the tipi on the bit till it melts the solder. If you have a P
Electronics Forum | Mon Oct 09 13:41:20 EDT 2017 | dleeper
developing a reflow profile is about balancing two variables, time and temperature. If its too hot, you damage parts, if its too cold, the solder won't melt. If the belt speed (time) is to rapid your temperatures will ramp to fast, if its too slow, y
Electronics Forum | Fri May 01 08:15:36 EDT 2009 | davef
Scavenging Methods [Improve Solder Scavenging of Large Area-array Sites, SMT, Laurence Harvilchuck, process research engineer, Unovis Solutions, harvilch@unovis-solutions.com] Two common methods exist for scavenging residual solder on the site for s
Electronics Forum | Tue Nov 29 12:53:56 EST 2005 | bschreiber
Hello Billy, You are correct when you say that you may want to look at the detergent (chemistry) you're adding to the stencil wash. However, "geared for epoxy removal" depends on how the chemistry is designed to remove the epoxy. If it is a "water
Electronics Forum | Thu Oct 22 15:10:00 EDT 1998 | Chris Fontaine
| I'M LOOKING FOR A SOLVENT TO MAKE REMOVING EPOXY FROM THE BOTTOMSIDE OF BOARD ON SMT COMPONENTS. THIS IS MOST IMPORTANT AFTER THE EPOXY HAS CURED AND EVEN RAN THROUGH THE WAVE. I'M LOOKING FOR A WAY OF | MAKING THE REWORK PROCESS ON THE CURED EPOX
Electronics Forum | Tue Dec 22 12:32:16 EST 1998 | Earl Moon
| Folk's, | I'm in need of some help / direction. I'm working on my thesis for a masters based on looking at the effect's of the solder resist promoting / reducing the amount of solder ball's during wave. I'm looking at thing's like colour, texture,
Electronics Forum | Thu Jul 31 11:33:51 EDT 2003 | yngwie
I faced problem over connecter's pin that were hot air soldered. This connector has 168 pins ( similar to the straddle connector ). The process is to apply the flux onto the connector's J-leads, and the hot air pencil were then ran thru' the leads to
