Electronics Forum | Thu Aug 17 01:31:31 EDT 2000 | Dreamsniper
Steve, I'm using 5 Sn/1.5 Ag/93.5 Pb Solder wire with a melting point of 300 deg. C to connect my thermocouples on smd components for thermal profiling. I'm using a soldering iron with an adjustable temp. to be able to melt my solder wire. Temp is ab
Electronics Forum | Fri Feb 03 17:25:47 EST 2012 | tombstonesmt
We've been having issues with our current process of oven profiles. We use a high temp adhesive to bond the thermal couples to the desired components. The issue of them letting go or releasing during reflow temps are hit or miss. Majority of our buis
Electronics Forum | Wed Feb 04 10:24:05 EST 2009 | dyoungquist
We use SN100C in our selective solder process. The 3 keys to proper hole fill are applying a proper amount of flux, heating of the pcb and solder temperature. If either the pcb or solder is not hot enough, you may not get good hole fill. To adjus
Electronics Forum | Thu Jan 31 07:02:00 EST 2002 | martino
The whole process counldn't be easier. The sales reps' try to turn the whole thing into some crazy black art-its not. The stencil supplier will have their own standard 'glue dot' configurations, and 9 times out of 10 these are more than adequate. As
Electronics Forum | Thu May 13 21:45:14 EDT 1999 | ardis
I am seeing reflow around my signal pins after being subjected to a profile of 204c for 1 minute and 225c for a min of 30 seconds. Signal pins are soldered into a copper plated alum. case with SB5 and then silver plated. The pins have a hot oil tin
Electronics Forum | Thu May 30 07:28:15 EDT 2002 | jaltland
Ben, Thanks for the input on the apertures and thickness. The side two problem, is not reflow. We have no trouble with reflow. The problem is that our product is high precision crystal oscillators. In order to get the precision needed, we have t
Electronics Forum | Wed Mar 30 15:16:35 EST 2005 | Rashid
Hi, I've measured a rework profile on a summit 750. my nearby parts are heating up as high as 178 to 182 degrees C. I'm concerned that this fine pitch parts that are nearby are affected specially their solder joints going to close to melting point.
Electronics Forum | Wed Mar 30 15:29:37 EST 2005 | Mark
I am not an expert however, I don't see any issues with this. Those joints of nearby components will melt and solidify back once they go below 183 C. Don't see how this could present quality issues as components may pass through reflow several time
Electronics Forum | Sat May 28 04:56:23 EDT 2005 | WDLau
Dear, I am looking for the supports, specification, etc of the solderiability of Hot bar Reflow process with: A). FPC plating with sb/pb= 90/10, to be mounted to B) B). Golden plating PCB Please kindly input, As far as I know the melting point of
Electronics Forum | Mon Dec 12 21:38:05 EST 2005 | davef
Effect of lead on bismuth solders * Lead from hot air leveling (HAL) coatings can diffuse through the grain boundaries of the alloy. * Lead can form a eutectic composition of Bi52Pb32Sn16 in the grain boundaries. * Melting point of this eutectic all
