Electronics Forum: adhesives hot melt (Page 8 of 18)

Double Sided Reflow - Low Melting Point Solders

Electronics Forum | Mon Apr 03 11:48:31 EDT 2006 | stepheniii

How big are the parts? I've only seen a few parts that ever fell off. Double sided reflow is probably the most common these days The surface tension is powerful. I think the lower limit of temperature is what you would have to worry about with epox

Bismuth containing Solder Paste

Electronics Forum | Thu Jan 15 10:33:05 EST 2009 | rrpowers

One thing you must be very careful with when using Bismuth is that there is no lead anywhere else within the process, either components or boards. Lead-terminated components or hot air solder leveled (HASL) finished boards used in combination with a

BGA pads lifting from PCB

Electronics Forum | Thu Jul 02 13:10:22 EDT 2009 | kpm135

On first glance it looks like those particular pads were not attached to any traces. If I had to guess I would say that your rework profile got hot enough to melt away the glue holding the pads to the board and they came away with your part when you

Mysterious reflow problem

Electronics Forum | Tue Sep 01 02:57:42 EDT 2009 | d0min0

davef As for the repair : - with hot air blower it is not possible (you can melt, but it will not wet) - with standard iron - no problem to repair (no additional material is needed) isd.jwendell yes, the profile is checked on those places (same si

QFN Rework Issues

Electronics Forum | Wed Feb 13 09:30:32 EST 2019 | SMTA-Joe

*UPDATE* I decided to modify the experiment slightly by forgoing my attempt to achieve reflow with the component. Instead I applied SN42 paste directly to the pad and attempted reflow of the paste by itself. The end result is as follows: Hotplate

It's possible

Electronics Forum | Wed Nov 03 22:25:09 EST 1999 | Steve Evers

...Just not sure you'd want to pay for it just yet. NdYAG wavelength, slightly diffused beam, tightly moderated power and amplitude control. Add to that a laser safe enclosure that insists on watching your work through a dark green filtered window

solder mask wrinkles

Electronics Forum | Tue Oct 19 10:53:14 EDT 1999 | Carol Zhang

Hi, I tried to use high temperature solder (540 - 570F)to connect four spacers on the board. The solder mask around the spacers wrinkled a lot.I can even see a few bulbs around it. I use hot plate and solder rings. After hot plate is heated to appr

Use of Linear Technologies LTC1733

Electronics Forum | Wed Jan 07 09:09:44 EST 2004 | russ

Her is how we rework these typew of components. First remove the device using hot air. It is sometimes helpful to heat the back of the board if possible to get the thermal pad heated with less strain on adjacent comps. Remove the remaining solder

No Lead BGA Hot Gas Rework

Electronics Forum | Mon Apr 12 09:09:25 EDT 2004 | russ

If they are reflowing pbfree balls to bare PCB pads they are getting that component very hot tpo melt the balls and get them to wet to the pads! I would not recommend this process at all for hightemp solder balls, for 63/37 this process is fine. As

BGA post SMT reflow?

Electronics Forum | Fri Aug 14 18:48:36 EDT 2009 | secura1

It's some time difficult to control process when > using a heat gun. What is the intent of using the > heat gun after test? we agree... the heat gun method was an experiment. We are planning to us a hot air re-work station. The intent is to re-


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