Electronics Forum | Sat Mar 27 03:57:09 EDT 2010 | grahamcooper22
I agree with Steve. Your are too hot and too hot for too long. What is the device spec for Peak Package Temperature (PPT)? (this is usually on the moisture barrier bag) Many leaded BGAs have PPT of 225 Deg C. Even if it is higher, like Steve suggeste
Electronics Forum | Wed Mar 14 18:17:40 EST 2001 | mparker
Some thing to watch out for is the cure spec for the adhesive. Will that match with your solder paste reflow spec? You will have two dissimiliar materials going through endothermic reactions at the same time. You could end up with under cured adhesiv
Electronics Forum | Thu Aug 06 12:49:41 EDT 1998 | justin medernach
| I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and the
Electronics Forum | Mon Apr 03 01:35:31 EDT 2006 | darby
I have a less than perfectly designed pcb requiring double sided lead free reflow. Several components from either side will detatch using the standard process. If I was using Sn63Pb37 I would just dispense some adhesive after paste and cure at the r
Electronics Forum | Fri May 14 00:28:09 EDT 1999 | Mike D.
| I am seeing reflow around my signal pins after being subjected | to a profile of 204c for 1 minute and 225c for a min of 30 seconds. Signal pins are soldered into a copper plated alum. case with SB5 and then silver plated. The pins have a hot oil
Electronics Forum | Tue Aug 17 09:43:59 EDT 2021 | lay1014
Application of vacuum technology VACUUM FURNACE Metallurgical industry: The vacuum technology used in the metallurgical industry includes molten steel vacuum processing, vacuum melting, vacuum induction melting, induction shell melting, vacuum arc re
Electronics Forum | Tue Sep 22 12:25:31 EDT 1998 | Chrys
| | Hi Jacqueline! | | Do these joints that you're having problems with happen to be on fine pitch solder joints? Are the fillets staying attached to the foot and separating from the pads cleanly? | | If that is true, are there many vias concen
Electronics Forum | Thu Sep 23 14:30:09 EDT 1999 | Earl Moon
| | | | | | Hiya, | | | | | | | | | | | | Could anyone please suggest recommended manufacturers of | | | | | | IR rework stations for the removal of various SMT comps. | | | | | | | | | | | | Cheers | | | | | | | | | | | Why IR ? Ok, I�ve seen on
Electronics Forum | Mon May 24 17:17:21 EDT 1999 | JohnW
| | Can anyone steer me towards a supplier of heatsinks suitable for use on a PQFP 160. Before you shoot me down in flames, I know that I am not going to get much heat away from the die because of the plastic but the application is such that the boar
Electronics Forum | Wed May 06 19:51:46 EDT 1998 | D.Lange
| Dear Freinds, | DOES ANY ONE OF YOU WILL BE KIND ENOUGH TO GIVE SOME INPUT ON DOUBLE SIDE REFLOW OF COMPONENTS WHAT ABOUT BOTTOM SIDE COMPONENT HOLDING DURING 2ND SIDE REFLOW? ANY IDEA OTHER THAN USING SLDERPASTE WITH OFFSET MELTING POINT, EPOXY DI
