Electronics Forum: adhesives hot melt (Page 10 of 18)

smt components vs. wave solder

Electronics Forum | Mon Nov 11 11:42:26 EST 2002 | MikeF

Like Mark, I'm guessing your problem is with SMT parts on the top side, the solder is re-melting and some of the parts are moving around during when the board is being wave soldered. When I had some training on thru hole wave soldering way back when

BGA rework

Electronics Forum | Mon Apr 26 09:11:04 EDT 2004 | Daniel

Thanks, We currently use Metcals for our regular work and I was looking at the ERSA system for the BGA rework. From what I have seen it seems simple to use, and since it uses IR you don�t need all the attachments for different size BGA�s. You just

Re: IR rework stations

Electronics Forum | Tue Sep 28 04:07:33 EDT 1999 | Jacqueline Coia

| | | | | | | Hiya, | | | | | | | | | | | | | | Could anyone please suggest recommended manufacturers of | | | | | | | IR rework stations for the removal of various SMT comps. | | | | | | | | | | | | | | Cheers | | | | | | | | | | | | | Why IR ?

Re: IR rework stations

Electronics Forum | Tue Sep 28 04:27:04 EDT 1999 | Wolfgang Busko

| | | | | | | | Hiya, | | | | | | | | | | | | | | | | Could anyone please suggest recommended manufacturers of | | | | | | | | IR rework stations for the removal of various SMT comps. | | | | | | | | | | | | | | | | Cheers | | | | | | | | | | | |

Re: reliability of epoxy

Electronics Forum | Fri Aug 07 01:02:51 EDT 1998 | zeek - just wanna to get a word in here

| | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and t

Re: Heatsinks for surface mount devices - adhesive alternative!

Electronics Forum | Tue May 25 10:56:12 EDT 1999 | John Thorup

| | | Can anyone steer me towards a supplier of heatsinks suitable for use on a PQFP 160. Before you shoot me down in flames, I know that I am not going to get much heat away from the die because of the plastic but the application is such that the bo

Re: FLUXED WIRES

Electronics Forum | Thu Oct 26 08:59:57 EDT 2000 | ptvianc

Performing a wetting balance test would be very difficult. The flux cored wire "configuration" is just not compatible with the methodology of the wetting balance test. If the wetting balance is a must, then you might ask the vendor for the flux for

Vent Residue Cleaning

Electronics Forum | Fri Aug 16 11:03:22 EDT 2002 | Claude_Couture

I use Kyzen's Aquanox SSA cleaner in a heated parts cleaning tub to clean anything with flux condensate on it. When heated to 120F, the stuff melts away like ice under hot water. When the cleaning solution is loaded, I send it in an evaporator. The s

QFP Removal

Electronics Forum | Tue Feb 17 17:55:38 EST 2004 | bman

I might be saying something that will get me laughed off of SMTnet forever, but when faced with a similar problem here's what I did. Since I was removing parts I didn't see why I would be concerned about all the things that go on in a good temperatu

BGA rework

Electronics Forum | Thu Mar 18 16:39:14 EST 2004 | Jed Johnson

A few good points have been made here: The profile could be ramping too fast. The profile could be gettting too hot. The profile may need to have more "soak" time before reflow to allow the board temperatue to equalize and the board to "relax" and st


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