Electronics Forum | Fri Jun 18 04:15:27 EDT 1999 | Frank
I would like to carry out a survey of all the available flipchip bump metallurgies available with the compatible bond pad finishes and compatible substrate attachment methods. The results will be posted on this forum. Your input will be very much app
Electronics Forum | Mon Sep 27 07:27:01 EDT 1999 | Stefan
Does anyone know if the CP40/CV or any other pick and place machine from Samsung can place flipchip ? I also would like to know what SAMSUNG users think of the equipment that SAMSUNG have to offer. Thanks in advance //Stefan
Electronics Forum | Tue Feb 17 01:12:52 EST 1998 | J.H. Kim
In solder bumping in flipchip technology by splder printing, the precise control of solder volume and height is very difficult. Therefore I'd like to know the solution of this problem. Thanks
Electronics Forum | Tue Feb 17 01:15:26 EST 1998 | J.H Kim
| In solder bumping in flipchip technology by solder printing, | the precise control of solder volume and height is very difficult. | Therefore I'd like to know the solution of this problem. | Thanks
Electronics Forum | Fri May 26 05:49:09 EDT 2000 | Richard Wilders
1.67. A lower accuracy will result in many off-pad flipchips; this means a lot of displacements. And there is no chance at all the flipchip will self-center back to the correct placement spot. I think you'll have to evaluate machinery that is capabl
Electronics Forum | Thu Sep 03 12:40:11 EDT 1998 | Aselco electronics
We are writing to have information about the automatic mounting process of flip-chip. We want to know if it's possible to mount this type of component(flip-chip) with smt tecnology machines.( Pick and Place Tdk or Samsung machines). Thanking you in a
Electronics Forum | Mon Jun 11 21:57:55 EDT 2001 | davef
Go to the IPC website [http://ipc.org] and buy "J-STD-012 - Implementation of Flip Chip & Chip Scale Technology".
Electronics Forum | Fri Sep 04 09:39:54 EDT 1998 | jim foley
:I believe it can be easily done using the universal GSM platform. You may want to contact Universal instruments corp. in Binghamton NY for further information. We are writing to have information about the automatic mounting process of flip-chip.
Electronics Forum | Wed Sep 03 00:25:24 EDT 2003 | severs
I was recently approached by a leading industry consultancy group and was asked, ..."if there have been any major advances or developments in the field of electronics production, what are they?" It got me to thinking, we've certainly witnessed some
Electronics Forum | Tue Mar 15 13:24:44 EST 2005 | pjc
There is equipment available to clean NC residues off low standoff devices, well below 0.8mm (0.031"), from Speedline Technologies- Electrovert and Accel. See this paper under Accel: "High Reliability Underfill Performance through Proper Flip-Chip D
