Electronics Forum | Fri Sep 18 15:54:31 EDT 1998 | Brian Stumm
I hope everyone who replies will do so on the forum as well. I have been considering attending this show too but there are so many trade shows (as a reflow manufacturer you must consider world wide as well) it is hard to select which are the best and
Electronics Forum | Fri Oct 06 08:48:11 EDT 2000 | CAL
NJEV- You can contact me off line for my opinion on the Easi line :caldon@smtnet.com. Compared to past products this one was weak. Missing parts, Screws sticking out, the thermo-sensor was right next to the button so the longer you held the button th
Electronics Forum | Wed Sep 03 18:20:00 EDT 2003 | davef
Major advance: Productionization of SMT. Minor advances: * Realization and control of solder paste characteristics * Vision alignment controls in printers. * Evolution from mechanical centering [through laser alignment controls] to vision alignment
Electronics Forum | Wed Nov 18 14:42:22 EST 1998 | Dave F
| I heard somewhere that SMEMA has joined IPC, and that the association has decided to boycott Nepcon from | year 2000. Can anyone tell me if this is true | Nick: SMEMA and IPC are talking about merging (EP&P, 11/98, p 18). Below is a news release
Electronics Forum | Tue Jun 22 09:59:38 EDT 1999 | Vic Lau
| | Do anyone have any experience on assembling high frequency product, 1.8GHz or 2.4GHz. | | | | In our production line, we manufacture 1.8GHz product with using no clean paste (RMA type) for reflow and no clean wire for rework. In our functinal te
Electronics Forum | Mon Jun 21 09:32:28 EDT 1999 | Glenn Robertson
| Do anyone have any experience on assembling high frequency product, 1.8GHz or 2.4GHz. | | In our production line, we manufacture 1.8GHz product with using no clean paste (RMA type) for reflow and no clean wire for rework. In our functinal test,eit
Electronics Forum | Tue Nov 06 10:28:58 EST 2018 | davef
Media Links IPC Global Insight This weekly electronic newsletter includes IPC news and multimedia information on manufacturing and management best practices and solutions, new technologies, standards, government relations and environment, health and
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
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