Electronics Forum | Thu Jun 17 17:04:43 EDT 1999 | Doug Batten
Does anyone have experience with placing heat sinks on BGAs? I have limited experience with PSA (pressure sensitive adhesives)heat sinks, and am interested with the possibility of a clip-on device. I am specifically concerned with ease of assembly
Electronics Forum | Thu Jun 24 14:14:25 EDT 1999 | Chris
| Does anyone have experience with placing heat sinks on BGAs? I have limited experience with PSA (pressure sensitive adhesives)heat sinks, and am interested with the possibility of a clip-on device. I am specifically concerned with ease of assembl
Electronics Forum | Mon Jul 12 13:06:32 EDT 1999 | Earl Moon
| I had parts replaced on SMT PWBs and the repair created measling defects. | Reliability Question: | Q1. Can measling be aggrevated or grow over time due to | temperature cycling and moisture. Customer environment is | -62C to +85C. | | Thank
Electronics Forum | Thu Nov 23 20:01:05 EST 2017 | myke03o
Hi to all experts, Can anyone advice us what solder alloy to use for thermal cycling products. We are facing a lot of issues using normal solder paste SAC305. After thermal cycling the solder is cracking. Any suggestion is welcome. Thanks in advanc
Electronics Forum | Thu Jun 17 20:57:44 EDT 1999 | Earl Moon
| Does anyone have experience with placing heat sinks on BGAs? I have limited experience with PSA (pressure sensitive adhesives)heat sinks, and am interested with the possibility of a clip-on device. I am specifically concerned with ease of assembl
Electronics Forum | Tue Jun 08 05:02:09 EDT 1999 | Charlie Thornton
Can anyone please help me locate details on maximum allowable temperatures of components when passing through a reflow oven. I think I want the thermal profile for the part, or a source or standard which will allow me to check if I can safely reflo
Electronics Forum | Thu Aug 14 18:04:36 EDT 2008 | smt_guy
I have made couple of investigations with our oven. I set-up 5 product profiles and run a thermal profile measurement and record them. Then I set-up one more product profile and rename that as Validation Profile then measured the thermal profile. A
Electronics Forum | Wed Apr 05 08:33:36 EDT 2000 | Robert Hartmann
Can someone lead me to some articles or technical standards showing formulas/design criteria for thermal management in a BT BGA? I need to be able to dissipate about 4 Watts, and am having trouble finding information on how to calculate what our BGA
Electronics Forum | Fri Nov 02 10:57:11 EDT 2007 | 85638
7500 mm3 in combination with very small devices like 0402 in the same assembly ?. I am facing profiling problems due to this extreme mix. Thanks in advance for your valuable inputs.
Electronics Forum | Thu Aug 26 03:58:32 EDT 2010 | jacki
Hi all Did anyone encounter that the thermal crack failure or any failure issue by using the Kemet Ceramic Cap, particularly 0.1uF,while wave soldering? Before using this part, I want to clarify whether it is suitable for our process or not. Thanks i
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