Electronics Forum | Mon Jul 02 06:01:22 EDT 2001 | wbu
Well, I�ve never encountered any problems with it. If you use paste in the specified window according time and environment there should be no problem. If you try to measure this force you would IMO check out if you yourself did not treat the paste as
Electronics Forum | Mon Jul 16 08:56:56 EDT 2001 | Hussman
Easy, DL says the customer is telling him after 5 reflow processes they get solder under the mask. He tried it and didn't see anything. DL needs more information to understand why and where this is occurring. So, if he can't duplicate the problem
Electronics Forum | Sat Jul 07 08:19:47 EDT 2001 | Stefan Witte
If your pads are raised as you mentioned, you will reach just the tip of your tiny glue dot, which may not hold the part in place. However, you should be using two glue dots on each side of your 0402 component. See under adherence force in paste a
Electronics Forum | Thu Jul 12 20:55:37 EDT 2001 | davef
First, we don�t like pallets, but ya gotta do wat ya gotta do!!! Second, we used to pallet after print and before place, but we lost so many prints messing with palleting boards that we now pallet, print, place. Third, most of our pallets are �home
Electronics Forum | Thu Jul 19 22:52:43 EDT 2001 | davef
Most paste manufacturers talk about a 12 month shelf life for paste. They give the user half of that time. The remainder is used-up in processing and distribution. We'd give it a shot. You paste supplier should be able to give you a much clearer
Electronics Forum | Sat Jul 21 00:38:46 EDT 2001 | dougk
Where did this come from? I hope our safety director doesn't see this or I'll have more work to do. Seriously, if is bacterial contamination, it would be lysed immediately on contact with the iron. We ask our operators to wash their hands after handl
Electronics Forum | Sat Jul 28 03:05:35 EDT 2001 | Frank
Hi guy Does anyone have experiance with printing problem between solder paste water soluble 62/36/2 and gold plating PCB? I do have problem about insufficient solder after printing although I used the same printing parameter as when I print with ano
Electronics Forum | Mon Jul 30 09:31:46 EDT 2001 | kennyhktan
Dear All, I'm now facing with 0805's component missing problem at the production after mounting. In able to containing the defect I'm been trying to increase the soldering strength by changing the stencil thickness from 6mil to 8 mil on a step do
Electronics Forum | Tue Jul 31 03:06:11 EDT 2001 | Lex WW
I am planning to evaluate DEK's Formflex board support system in our plant soon. Does anyone have experiences with this? I know that the grid of pins "locks on" to a particular product after the initial setup, but am curious to know how each individu
Electronics Forum | Tue Jul 31 20:05:11 EDT 2001 | davef
There is no the industry standard specification for resisitivity monitoring at aqueous cleaning. Beyond those posted here earlier by Mikie, guidelines can be found in the fine SMTnet Archives, for instance: (http://www.smtnet.com/Forums/Index.cfm?CF
