Electronics Forum | Thu Oct 26 14:51:46 EDT 2000 | eramirez
Currently I am running a very dense PCBA using a PCB less than 20 mils thick. We have two facilities running this product. One is using Nitrogen during reflow one is not. What is the advantage and disadvantages of using Nitrogen during the reflow
Electronics Forum | Thu Oct 26 17:48:12 EDT 2000 | ptvianc
Hi: Generlly speaking, in a reactive mode, nitrogen blankets are used to improve the yield of a process that is marginal in terms of removing, and/or preventing the re-appearence of, oxides on copper features or component I/Os. That marginality can
Electronics Forum | Mon Mar 22 09:37:28 EST 2004 | ellis
After 2nd time reflow of double reflow, wrinkles solder joints found on SOIC and SOT components.(only happen on the components at the underside of pcb during reflow, top side components dont have this problem) is this due to the reflow process proble
Electronics Forum | Sat Apr 04 03:24:41 EDT 2009 | monduran
Our company is in the market to replace the $50 toaster oven we use to reflow boards with something that can actually achieve even temperature and a proper reflow curve. We are a RnD type company and have no need for volumes. Though we have some heav
Electronics Forum | Tue Jun 25 23:54:54 EDT 2019 | anhsang38
Dear Everyone, I'm having problem. the Switch component drop after reflow. First, this component placed on top side and through Reflow. Next, the Bottom side is placed component and through reflow. After that, the switch drop and have a gap. We are u
Electronics Forum | Tue Apr 07 22:34:14 EDT 2009 | 1036
Board delaminated after reflow - see attached picture. Does moisture cause this problem?
Electronics Forum | Thu Jun 27 11:56:40 EDT 2019 | slthomas
It seems to me that it would be easier to manually apply a little bit of chipbonder on the edge of the part after the first reflow than to tape the part down. The epoxy would cure sufficiently before the second reflow to secure the part after the s
Electronics Forum | Wed Dec 08 19:16:20 EST 2010 | jgalarza
Can anyone tell me if there is a formula for finding the after reflow height of solder with no part attached? I have to print some pads that do not have any parts but there can not be more than 1.5mil of solder on the pad after reflow. I am going to
Electronics Forum | Sat Jun 27 10:45:18 EDT 2020 | SMTA-Davandran
Hi Indhu, Check for solder paste height. Please manually add solder, mount component and reflow.
Electronics Forum | Fri Jun 26 14:08:49 EDT 2020 | indhu
Hi, I am having a issue that SMT nut drop after reflow. The solder height all in specifications. Had tried adding flux inand the solder paste. But shows no improvement. Is the nut easily oxidize? Can anyone help me on this?
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