Electronics Forum | Mon Mar 29 13:16:10 EST 2004 | russ
The only time I have ever had this happen was with un/not fully cured solder resist. Only shows up after wave. I believe that is because of the higher temp than reflow but don't know for sure. No help but what the hey Russ
Electronics Forum | Mon Feb 23 20:27:27 EST 2004 | greg york
Is this a white residue on the joint and surrounding area's, if so the only thing I can remove it with after cleaning is an Isopar(Isoparrafinic hydrocarbon), my guess looking at other pastes where I have seen this is it is a type of wax used in form
Electronics Forum | Mon Feb 23 20:27:31 EST 2004 | greg york
Is this a white residue on the joint and surrounding area's, if so the only thing I can remove it with after cleaning is an Isopar(Isoparrafinic hydrocarbon), my guess looking at other pastes where I have seen this is it is a type of wax used in form
Electronics Forum | Mon Feb 23 20:27:34 EST 2004 | greg york
Is this a white residue on the joint and surrounding area's, if so the only thing I can remove it with after cleaning is an Isopar(Isoparrafinic hydrocarbon), my guess looking at other pastes where I have seen this is it is a type of wax used in form
Electronics Forum | Thu Apr 01 03:22:59 EST 2004 | paul pmd
Deltawave flux pump continously runs while in run mode. After the pump there is a flux manifold distribution block. When switching between fluxes not all previous flux is purged or drained. When no clean is installed some cross contamination may occu
Electronics Forum | Fri Apr 09 09:08:40 EDT 2010 | cast2010
Hello, I produce two types of board. - 100% Thru Hole - 50% thru hole and 50% SMT For the second, I have a bad wetting after the reflow on the top. The pcb board have Au-Ni pad. I use a water soluble paste. I clean the board with a solution with
Electronics Forum | Fri Apr 09 20:47:36 EDT 2010 | 89jeong
I think the oxidation on the pad happens easily but do not on Au plated pad.The reason may be caused by improper cleaning or Au plating thickness in plating process. But,before suspecting the pcb board, you need to check your process or used material
Electronics Forum | Tue Oct 29 21:27:21 EDT 2019 | aqueous
It depends on the flux type. If it's water soluble, it should be cleaned soon after reflow because OA flux remains active after reflow. If it's rosin or no-clean (low-residue), then the only concern is the longer wait time, the more difficult it will
Electronics Forum | Sat Jan 25 20:17:40 EST 2003 | ramanandkini
We are soldering a 8 pin TTL chip on to a CEM1 board that has a hot air level soldering. We use no clean soler paste for the reflow process. Now the customer wants us to clean since he is afraid of flux attracting the dust. We have some SMT LEDs that
Electronics Forum | Wed Oct 30 02:12:39 EDT 2019 | jags
yes and thanks for this feedback. we clean with degreaser ( strong) and flux is rosin with 10% in the paste (koki). we clean after second reflow . the gap time from bottom to topside completion is 10 hours. cleans with this time. my even after 20 h
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