Electronics Forum | Tue Aug 24 13:45:17 EDT 2004 | Indy
Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th
Electronics Forum | Tue Aug 24 13:47:14 EDT 2004 | Indy
Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th
Electronics Forum | Tue Aug 24 13:47:16 EDT 2004 | Indy
Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th
Electronics Forum | Tue Aug 24 14:49:58 EDT 2004 | jamyboy
Hi, I am trying to assemble a LTCC component > with Pd/Ag surface finish on to Sn/Pb/Ag solder > and Sn/Ag/Cu solder. I am passing it through a > reflow. I have observed poor wettability at the > solder-pad joint. Does anyone have information
Electronics Forum | Wed Jan 24 10:08:36 EST 2007 | electronhose
Immersion Silver, ImAg, is becoming the finish of preference. This is due to it having similar process limits vs. SnPb HASL. There were some early concerns about shelf life, but new chemistries have extended finish shelf life to 12 months+. Many boar
Electronics Forum | Fri Aug 13 16:54:20 EDT 2004 | davef
If the terminations on your components are not barrier plated, you must be very careful about the amount of time you stay above liquidous. As you'd expect, longer is not better. The longer you stay at liquidous, the more of the component terminatio
Electronics Forum | Mon Dec 19 08:56:18 EST 2005 | davef
Q1a. If the thickness of the silver is too much (how is too much??), A1a. We have heard stories of using Ag2 to limit silver [or gold] dissolution, but have never seen formal studies to demonstrate that idea. First, exclude the use of silver plate
Electronics Forum | Tue Apr 04 12:44:08 EDT 2006 | Andrew
Anyone knows if there are some issues when you solder Silver finish components on Ni-Au finish pads with Sn/Pb/Ag solder paste (Indium)? (I must use components with silver finish) Thanks
Electronics Forum | Tue Aug 22 09:49:39 EDT 2000 | galltp
Dr. Lee, We have seen a small decrease in shear strength for Pb/Sn plated components attached with Sn/Ag/Cu solder compared to components with a Pb-free finish. With the jump in the cost of Pd, we are struggling to define a practical Pb-free
Electronics Forum | Fri Jul 23 09:12:34 EDT 2004 | davef
We have run not AgPd [that we know of]. We can comment on PdNi. [But you're probably have Ni under the AgPd] In general, palladium solution rate is much slower than other sacrificial finish materials that we use for the purpose. The key then is to
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