Electronics Forum | Tue Oct 10 12:56:15 EDT 2000 | Ken Van ZIll
I agree that homplate is a good design, but also this could be caused by the stencil thickness and aperture size, if you are at 7-9 mils thick stencil and a 1:1 ratio on aperture size then 2 things i know of will happen, one a squishing out of past o
Electronics Forum | Fri Sep 17 13:51:43 EDT 2004 | huib
We know from experiments that the structure of Sn can be manipulatedby means revese pulse-plating. This means alayer with less pits and thus a lower mminimum thickness is needed. www.ppcs.nu
Electronics Forum | Mon Jan 12 04:28:05 EST 2009 | sachu_70
What is your alloy composition? Although your solder paste may have lower melting point, what about the alloy / metal used for plating solder lands on PCB and component termination? In most cases, there is no reliable joint as such solder may not com
Electronics Forum | Tue Aug 30 22:38:54 EDT 2005 | cabs
Does any one knows where to get a plating thickness meter that can be use in the fine pitch contacts and trace in PCB application like BGA pads? If there's a hand held device at lower cost much better... Also if you can recommend companies that offer
Electronics Forum | Thu Oct 29 20:19:43 EDT 2009 | 89jeong
Hi. We are doing Au bonding on Al bond pad not Au plated. If pull strength is less than 2.0g, i think that the ball or stich may be lifted from bond pad. And the value become lower after several reflow. I expect that the surface of bond pad may be c
Electronics Forum | Wed Jun 17 01:02:16 EDT 2015 | armandogomez
Hello Had a similar problem way back with the hydra, first go to the service program manually activate the hydra camera then move the Xwagon to place the hydra ref plate over the hydra camera and check first if the camera works, second the image you
Electronics Forum | Wed Dec 14 20:17:48 EST 2016 | davef
As I understand, you are wire bond gold wire to gold pad, where the substrate has good bond strength, but the die does not. If bond quality is good, and then drops off rapidly, then it's probably something to do with contamination within the system
Electronics Forum | Tue Nov 01 18:00:07 EST 2005 | PWH
The front nozzle plate arm had a build-up of grease and material on the roller plate that is closest to the linear bearing. This material caused the nozzle plate to be lower than normal; therefore it was not able to push the nozzle all the way to th
Electronics Forum | Wed Jun 28 12:37:05 EDT 2000 | Brian W.
HASL plating, by its very nature, is inconsistent in terms of thickness and consistency. The plating varies from spot to spot on the pad, as well as pad to pad. This will wreak havoc on your screen printing process and your placement. From talking
Electronics Forum | Tue May 08 09:50:19 EDT 2007 | patrickbruneel
Hi Loco, Good point!! The good old glass plate works just fine as long as the conveyor or carriers have L shaped fingers. A glass plate is usually about a � inch thick (a lot thicker than the actual board). With L shaped fingers the bottom of the gl
