Electronics Forum: air kiss rv head (Page 1 of 2)

NXT head H04 placing problem

Electronics Forum | Wed Jan 23 20:01:20 EST 2019 | padawanlinuxero

Hello Sounds to me that the problem might be with vaccum and lot of it, after the component is place theres a small amount of air that pushes the component away from the nozzle in MYDATA we call it a kiss in my facility, have you check that the air

NXT head H04 placing problem

Electronics Forum | Wed Jan 30 00:56:00 EST 2019 | kiransahu

Sounds to me that the issue may be with vacuum and part of it, after the segment is put there's a little measure of air that pushes the segment far from the spout in MYDATA we consider it a kiss in my office, have you watch that the air that "puffs"

Siemens SIPLACE CF - Low vacuum on head

Electronics Forum | Tue Feb 05 13:14:27 EST 2019 | youngbuck

Hi Steve, Have you took the star completely off the Gantry. There are the 12 hoses to the star if Segment 1 connection hose is messed up everything will be off because everything gets measure off of Seg.1. Also, you could start eleiminating the probl

GSM Spindle Height / Zaxis calibration?

Electronics Forum | Mon Sep 20 20:43:19 EDT 2021 | ttheis

One of our GSM machines started having an issue with "spitting" parts onto the board / blowing them around. I determined the problem be that spindle #2 on our flex head is not touching the parts all the way down to the board. It is stopping just abov

Vacuum Delta

Electronics Forum | Wed Feb 27 14:07:25 EST 2002 | Stefan

In order to kiss off the components with an air blow, there are two times to consider: 1. reaction time of the solenoid ( to shut off the vacuum and turn on the air ), 5-10 ms 2. time required to fill up an air hose, which leads to the nozzle. Assumi

Skewed and popped components

Electronics Forum | Wed Sep 24 08:34:57 EDT 2003 | stefwitt

Even when you run a board several times, the machine may not make the same travel path every time. This in itself does not create a problem, but the vacuum on the nozzles could be different, dependent on the configuration of components on the heads.

Very fishy missing solder paste issue

Electronics Forum | Thu Jul 21 02:45:51 EDT 2005 | Base

Probably very far-fetched, but I can think of a scenario like this: - machine picks up a component - between vision and placement the part is lost, but the loss is not detected due to oversize tool, which causes the amount of vacuum drop to go unnot

Optimal Speed for Universal Chip Shooters

Electronics Forum | Wed Jun 11 16:30:33 EDT 2003 | T.Vick

You have received some great feedback so far. I would like to summarize and add a few points regarding maintenance. You should start (as recommended already) by verifying your component library data. Using the default values from the master library i

Adhesive Dispense Equipment

Electronics Forum | Sat Oct 27 12:01:32 EDT 2001 | Stefan Witte

Most of the machine suppliers Fuji, Siemens, Universal and Panasonic did regret that they were building glue machines. Applying adhesive compared to placing a component looks so simple, but it is not and the defect rate is higher than placing 1206 c

Standoff heights for glue syringes

Electronics Forum | Tue Aug 04 11:10:22 EDT 1998 | Chrys

| Hi Stoney, | Justin is giving you some good advice, unfortunately these kinda' problems sometimes call for the ol' D.O.E...otherwise, you could be chasing your tail for a while until you figure out exactly what's causing your problems. | Has

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