Electronics Forum: air quality (Page 5 of 21)

SMT Lines' Facilities Requirement

Electronics Forum | Thu Sep 29 10:21:11 EDT 2011 | davef

1. Floor loading requirement - The designer of your factory building specified the flooring with a certain floor loading capability. You need to determine that capability. You plan to install machines and equipment. You need to determine the weight o

QFN soldering

Electronics Forum | Fri Apr 20 01:42:37 EDT 2012 | thmeier

If you extend the pads you get the effect that the solder below the component is pushed to the outside land which results in a very low standoff of the component, deteriorate the overall quality of the solder joint. Hot air (pencil or some of the sem

siplace part missing

Electronics Forum | Sat Dec 13 08:03:46 EST 2003 | Stefan Witte

The only part, which could cause component misplacement on the rotary heads of the Siplace machine is the vacuum valve. I don�t know the official name in the part catalog, but I use to name it plunger. The plunger is moved in and out by a miniature s

Compressor for Pick and Place line

Electronics Forum | Thu May 28 16:18:01 EDT 2020 | SMTA-Brandon

The reason for recommendations about refrigerated vs. desiccant dryers commonly comes down to the ISO class of compressed air they deliver. Refrigerated dryers are most commonly used in ISO Class 4 compressed air, and can't dry the air enough to reac

Stencil Drying

Electronics Forum | Tue Feb 20 19:12:07 EST 2001 | billschreiber

Hello Kerry, If your stencils are going back into inventory rather than into production, expediting the drying process may not be necessary. Just place them on a rack and allow them to air dry naturally. That way you can maximize the throughput of

Flip Chip and lead-free soldering

Electronics Forum | Thu Jul 20 16:08:18 EDT 2000 | Grant Baynham

Do you have any experience with flip chip applications using lead-free solder, and specifically do you have any information revealing how the process parameters for standard air reflow atmosphere can be modified to match the results for solder reflow

Need help with my IoT Project ESP8266 NodeMcu to ESP12-E

Electronics Forum | Sat Mar 27 17:18:02 EDT 2021 | osfuco

Good evening, I am doing a project in which I want to measure air quality. I started the project with the ESP8266 NodeMcu board and three sensors, temperature (DHT22), VOC's (CCS811) and PM (PPD42). I have it all assembled with a breadboard and the

Obtaining EPA Certification

Electronics Forum | Mon Feb 19 17:37:04 EST 2001 | billschreiber

Dear Mary, There are two major programs provided by the Environmental Protection Agency (EPA), Certification and Verification. Basically, the California EPA Certified the Smart Sonic Stencil Cleaning Process and the U.S. EPA Verified the California

Micro Solder Balls and Vias bridging Issue

Electronics Forum | Tue Mar 03 09:29:48 EST 2015 | rgduval

A couple of things that have helped me with solder ball issues at wave in the past: 1. Flux. Insure good flux coverage on the bottom of the board. 2. Preheat. Insure that the board is sufficiently preheated for the wave operation. Since you're

DI water testing?

Electronics Forum | Sat Aug 25 00:26:22 EDT 2007 | aqueous

Dave, First of all, distilled water is not DI water. It is not the same thing. If you require DI water, you should know what quality is expected for your application. For example, for defluxing applications, generally DI water quality exceeding


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