Electronics Forum | Thu Jul 18 12:33:21 EDT 2002 | slthomas
Not sure if you're trying to improve your defect rate (we use dpmo) or your test yield. The question is what do you do if you're happy with your dpmo levels but not some of your first pass yield numbers because certain boards have more parts. Inspe
Electronics Forum | Wed Jan 28 10:56:31 EST 2004 | russ
the reason you don't want to use PPM is exactly the reason you need to. You cannot compare a square 1" block to a multi faceted custom machine part. In SMT assembly you will usually find that all 0603 and larger discreetes,25mil pitch, etc. are pro
Electronics Forum | Tue Oct 06 15:41:14 EDT 1998 | Mike C
| | Does sombbody know what DPM rate a good and reliable SMT assembly line (incl. solder paste print, assembly and feflow soldering) has? | | DPM is Defects per million, usually measured on components. We run a process consisting of small to medium b
Electronics Forum | Wed Oct 07 06:19:30 EDT 1998 | Charles Stringer
| | | Does sombbody know what DPM rate a good and reliable SMT assembly line (incl. solder paste print, assembly and feflow soldering) has? | | | DPM is Defects per million, usually measured on components. We run a process consisting of small to medi
Electronics Forum | Thu Oct 08 22:06:44 EDT 1998 | Eric R
| | | Does sombbody know what DPM rate a good and reliable SMT assembly line (incl. solder paste print, assembly and feflow soldering) has? | | | DPM is Defects per million, usually measured on components. We run a process consisting of small to medi
Electronics Forum | Wed Nov 18 11:03:45 EST 1998 | Scott Lolmaugh
| | | | Does sombbody know what DPM rate a good and reliable SMT assembly line (incl. solder paste print, assembly and feflow soldering) has? | | | | DPM is Defects per million, usually measured on components. We run a process consisting of small to
Electronics Forum | Tue Apr 01 09:46:26 EDT 2008 | patsama_n
Thank you for kindness advice. From the result of IC after pass the reflow process. The color of letter will change to similar color of material compound of IC. Then when we inspection by AOI machine, we have many problem about high fault reject rate
Electronics Forum | Thu Sep 19 21:46:01 EDT 2002 | scottefiske
In the past year I was responsible for developing and leading a Team focused on AOI, Evaluation, Justification, and with a full ROI required, supporting a HMLV manufacturing environment. If you have in these economic times the additional resources t
Electronics Forum | Thu Apr 04 05:33:19 EST 2002 | ianchan
Hi, hope this helps : 1) BCC (bump chip carrier) production for us, was with a 5mils Stencil. The outer perimeter smallish pads are not much of a problems. For the central large pad, we split the paste print (corresponds to the Stencil apperture op
Electronics Forum | Fri Oct 16 17:01:21 EDT 1998 | Justin Medernach
| | | | | | It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | | | | | | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | | | | | | Q: Can you get
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