Electronics Forum | Thu Jan 14 15:22:14 EST 1999 | Earl Moon
| Steve, | Whoa, take a breath! That was at least a dollar three-eighty answer. I've got to agree that nothing can replace a qualified, concientious operator for assuring quality. When I too worked at a small shop there in SillyCone Valley, my
Electronics Forum | Wed Jan 13 20:44:42 EST 1999 | Steve Gregory
Hello Sanjay! The cheap deal I use that Earl spoke of is called a SMarT Measure. It's a depth measuring microscope that uses the same principle of measuring optical focus that the units from Vision Engineering do ( if you've ever looked at any
Electronics Forum | Thu Jan 14 11:08:29 EST 1999 | Mike McMonagle
Steve, Whoa, take a breath! That was at least a dollar three-eighty answer. I've got to agree that nothing can replace a qualified, concientious operator for assuring quality. When I too worked at a small shop there in SillyCone Valley, my seni
Electronics Forum | Mon Sep 17 15:27:51 EDT 2001 | jschake
Challenges: The basic defects that impact assembly yield are bridging, satellite solder balls, and opens (i.e. tombstones / draw bridges). There are many variables with the stencil printing process that can impact these; several of them are listed
Electronics Forum | Sat Aug 21 12:38:09 EDT 1999 | Earl Moon
| Want to know the Tools/ Process required to get started with CSP prototyping and R & D. | Anyone working on this , please help out. | Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went through prototypi
Electronics Forum | Thu Sep 21 05:46:34 EDT 2000 | Wolfgang Busko
Once you know what your print should look like, means you have found the right apertures, stencil thickness, stencil finish and the right printer adjustments and alignments, the main things to watch for or better to control when printing is in progre
Electronics Forum | Sun Aug 22 08:21:39 EDT 1999 | Earl Moon
| | | Want to know the Tools/ Process required to get started with CSP prototyping and R & D. | | | Anyone working on this , please help out. | | | | | Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went t
Electronics Forum | Sat Aug 21 17:10:12 EDT 1999 | K. Vikas Sharma
| | Want to know the Tools/ Process required to get started with CSP prototyping and R & D. | | Anyone working on this , please help out. | | | Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went through p
Electronics Forum | Wed Jul 13 02:09:27 EDT 2022 | stiqa100
Printed circuit board assembly business in private business park for sale. An entire shop including surface mount pick and place machines, reflow oven, stencil printer, wave solder machine, in line washer, work stations with solder stations, hand too
Electronics Forum | Tue Nov 11 09:19:17 EST 2008 | davef
By the way you asked the question, we assume that by "reballing" you mean bumping, we should be able to figure that out: * Volume of the ball = ( pi*d^�)/6 = [355/113] *0.6*0.6*0.6]/6 = 0.11mm^3 * Volume of solder required = 2*volume of ball = 2*0.11
