Electronics Forum | Mon Nov 25 20:57:23 EST 2002 | Kermit
Thanks to everyone who has responded so far. We are going with dedicated tooling for our phone cards but not for our system cards so that takes that out of the equation for the former, will evaluate for the system bds.. Thanks for the info.. Regard
Electronics Forum | Thu Nov 14 09:43:33 EST 2002 | MA/NY DDave
Hi I will only hit only a few and then bug out. Worked with one large EMS place that has the "fail first" approach to engineering and manufacturing. ( I know I know THEY all do). They didn't store the paste as the mfg suggested, they didn't control
Electronics Forum | Fri Nov 15 17:36:45 EST 2002 | jonfox
First of all, who are you buying it from? If it is not coming with any coverage (parts or tech support) from Tyco, don't make this your first one. They can adjust to just about anything you can program on them (big plus) but I would recommend havin
Electronics Forum | Wed Nov 20 21:04:15 EST 2002 | yngwie
Hi Dave, What do you mean by "if the board is manufactured properly". If the board is not manufactured properly, humidity will have an impact on the peel strength? Is that what you mean. How does the Humidity impacted the peel strength ? Thru' which
Electronics Forum | Fri Nov 22 10:18:33 EST 2002 | Joaquin Rodenas
Dear Mr. Liang I'm a service ingeneer in a distributor of FUJI products. My first suggestion is get some help from the FUJI dealer in your territory, but anyway try the following: First of all, check again the FTP tool included in F4G-main windows
Electronics Forum | Mon Nov 25 07:58:27 EST 2002 | Yannick
Hi, I made a board wich I plated with immersion Tin, I tought it should be the same result as we had with tin lead but we ran into a weird problem. WE use a 63/37 no clean paste and on the Board with Immersion Tin the solder just make a ball ON
Electronics Forum | Mon Nov 25 09:06:15 EST 2002 | jax
You might want to check the tin thickness. I believe you have a minimum of .65 microns in order to achieve a good solder joint through 3 thermal passes. In an immersion tin process, the ability to solder is time and temperature dependant. As the int
Electronics Forum | Tue Dec 03 07:57:27 EST 2002 | pjc
Price of DEK 248 and MPM UP100 are about the same, $22-36K range. MPM UP100 has programmable squeegee pressure. Precise, repeatable results with less operator involvement. Pressure parameters saved in board program file. DEK 248 has manual microm
Electronics Forum | Thu Nov 28 20:37:40 EST 2002 | Dreamsniper
I'm in the process of generating work instructions for our stores and production process with regards to moisture sensitive devices.And I'm a bit confused. I found out that we have many TSOP's, QFP's and BGA parts in sealed bags that have not been op
Electronics Forum | Wed May 12 10:15:29 EDT 2004 | gabriele
Hi Dave, I've got it, many thanks. Snow ? My village is located latitude GMT + 1 hour,and about 45� north longitude. 30 Km north the mountains are still fully covered by snow. Sea is about 3 hrs driving down. My Job?, EMS'engineer (ex)
