Electronics Forum | Tue Sep 14 17:10:54 EDT 2004 | Jeff, jjg6@agere.com
USE JEDEC Specification EIA/JESD22-B102-C Procedure: 1. Stencil print BGA solder paste pattern onto ceramic substrates 2. Carefully and accurately P&P BGA devices onto the dispensed solder paste pattern to avoid smearing the solder paste. 3. R
Electronics Forum | Mon Sep 21 20:45:55 EDT 2009 | davef
10.4. Pre-Cure Examination. Immediately after material application, the uncured conformal coating shall be examined for: a. Bubbles and Air Entrapments. These defects shall be broken by vacuum, with a sharp probe, or other appropriate tools. b. Bridg
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