Electronics Forum | Fri Nov 18 07:14:53 EST 2005 | avalancher
It's easier if the Operator does keep an eye over that, HOWEVER, if you really think about it, you are allowing the very person who ran the board monitor the quality of the board (again, re-visiting AOI errors, and what they allow and don't allow). A
Electronics Forum | Mon Feb 14 18:12:44 EST 2000 | Brian Book
I believe that the Rheopump is the better design. The proflow uses a square chamber that doesn't allow the paste to roll. The control is far better also, and the design allows the use of standard piles cartridges.
Electronics Forum | Thu Feb 04 06:50:35 EST 1999 | Greg Flynn
What allowances are people using out there for components off-pad, we currently use 50% of lead width without breaking trace/component clearances but we have a customer demanding 25% allowance ?
Electronics Forum | Thu Feb 04 09:09:11 EST 1999 | Peet
| What allowances are people using out there for components off-pad, we currently use 50% of lead width without breaking trace/component clearances but we have a customer demanding 25% allowance ? | We use 50% for civile application, and 25% for mil
Electronics Forum | Fri Dec 07 11:23:27 EST 2001 | cmay
If you allow 3 seconds for insertion of each connector and 2-3 seconds for each solder joint, then add a 10-12% contingency allowance you shouldn't be far out. Maybe get an averagely rated operator to build one on the clock. Regards, Chris
Electronics Forum | Mon Jun 03 11:51:44 EDT 2002 | Troy
A 50KV machine will allow you to see solder bridges and balls under the BGA. It will also allow you to check placement and can "see" through the metal housing. If you want to inspect for voids, then you what to look at equipment in the 100KV range.
Electronics Forum | Fri Dec 19 17:39:07 EST 2003 | pdeuel
Dose the tolerances for the cutting blade and anvil on a HSP-4792 allow for sharpening. Replacement blades are over 2k$ and Universal tells me that tolerances wont allow sharpening. Can a percision sharpening shop be reccomended. Thanks in advance fo
Electronics Forum | Wed Dec 08 08:38:46 EST 2004 | davef
KS: You're correct. The standoff on a 1.00mm and 1.25mm BGA is high enough to allow cleaning. The standoff on 0.8mm BGA does not allow proper cleaning, even with saponifiers.
Electronics Forum | Mon Feb 07 15:38:32 EST 2005 | russ
We allow it (water only) as long as the bottle has a closed lid. We determined this to be acceptable since water is already present at each station for solder iron cleaning. We allow no other eating or drinking of any type. Russ
Electronics Forum | Mon Jan 11 13:31:54 EST 2010 | cbart
I know IPC is working on a spec for voiding for QFN'S. However since its not released I'm curious what others have defined as the max allowable % voiding on the leads (not center ground).
