Electronics Forum | Mon Dec 16 06:53:23 EST 2002 | lloyd
We simply don't allow any 'walkman' type systems to be used by anyone in our factory. It's simply from a health and safety point of view. Think of this scenario: everyone in a department wearing walkmans, a fellow worker in someway gets injured/falls
Electronics Forum | Mon Dec 16 13:18:23 EST 2002 | gregp
Your analogy of radio use in a car is not fair. In fact, I believe in many states the use of walkman headphones while driving a car is illegal. Just like in your work environment, you wouldn't be able to hear sirens (emergency vehicles or pick and
Electronics Forum | Mon Feb 03 12:52:42 EST 2003 | MA/NY DDave
Hi I won't give you an answer directly yet I hope the following makes sense. The max rework depends on what is used in the reliability model and/or experimental data as worst case for the applications end of life reliability needs. E.G. let's say
Electronics Forum | Thu Feb 13 23:23:30 EST 2003 | jkhaiar
Hi Dave F As usual an interesting issue. Employees working in hazardous environments and critical tasks were the safety of the personnel and the jobs are at risk; they should not be allowed to use any communication or entertainment media. Such means
Electronics Forum | Wed Jul 02 18:01:14 EDT 2003 | csimfgeng
We provide each assembly its own recipe then customize the unique recipe as required, using a SlimKIC 2000 profiler. This tool allows precise control of the reflow process and accounts for the component and layer densities of each board. This appro
Electronics Forum | Wed Aug 20 21:30:56 EDT 2003 | paulm
Our company if currently reviewing our BGA Screen Printing Process. The problem we are trying to eliminate has to do with BGA Ball Size Variance. Some of our vendors are allowing a +/- of 0.004" in ball size. This would allow for the possibility of a
Electronics Forum | Sat Mar 06 02:54:25 EST 2004 | tommy
1)Solder paste selection 2)Reflow profile.Focus on soaking and TAL. 3)Moisture control for BGA. 4)Maybe the BGA solder ball already with void. 5)PCB design.Any via on bga land? 6)Solder masking type. 7)Solder paste volume apply on land. 8)IPC class 3
Electronics Forum | Wed Mar 10 04:52:11 EST 2004 | Gabriele
Hi As I know PBGA reballing is not recommended or better not allowed by all the most important Standards. Exceptionally Cstly Ceramic BGA or Ceramic ColumnGA where you can perform electrical test before reballing (90/10 ball/column-balls made) some
Electronics Forum | Tue Sep 21 13:24:17 EDT 2004 | GS
Hello, does any one please can tell me if any Standard says how much is the Total Ion Contamination ( ugr/NaCl sqcm equivalent, Br- in particular way) allowed on Connector surface/body ? (ie. DIMM connectors, and similar). Many Thanks in advan
Electronics Forum | Mon Feb 13 11:02:05 EST 2006 | Alan
Hi Grant, Does the Flex mag have the corect pal chip in it? Some of the early Flex mags had tm8 pal chips in them. On the machine this did not have much of an effect (it did at one time allow you to have the hydra pick from the flex because the mach
