Electronics Forum | Tue Jan 11 11:38:46 EST 2005 | gregp
How is it that 16 month old posts get revived just for the reason of reckless slander? Even more puzzling is why the persons responsible will not reveal their identity or at least allow themselves to be emailed? My opinion is that the people that r
Electronics Forum | Tue Sep 20 10:32:25 EDT 2005 | slthomas
I would say it depends on the process requirements for the board and the reliability requirements as has already been mentioned. If you do two-sided reflow you might allow for fewer rework attempts, for example. If it's a medical device you might on
Electronics Forum | Sat Oct 29 21:24:30 EDT 2005 | Paul Standeven
The CSM84 family units are 3 headed pick & place machines with mechanical chuck centering technology. They use a beam pointer for fiducial correction. The CSM84V is the same as the CSM84 but has a downward looking fiducial camera onboard in lieu of
Electronics Forum | Fri Nov 11 08:30:12 EST 2005 | GS
HI all, which is the last "though" about the max Pb % allowed/acceptable into a Pb Free Alloy ? For istance inside : - HASL Process Solder Pot Alloy - Wave Solder Pot Alloy ( 400Kg mass average) - Static Wave Solder Pot Alloy - Etc IPC-J-
Electronics Forum | Tue May 02 13:57:21 EDT 2006 | patrickbruneel
What you can do is perforate the board holding rim by drilling holes of 0.6mm (similar to via's). This will reduce the mass and heatsinking capacity, allow excess flux drainage and facilitate convection heat contacting the board through the holes. Th
Electronics Forum | Wed Jan 14 13:38:38 EST 2009 | vleasher
I am attempting to identify a good epoxy to hold on larger parts on thru the reflow process for the opposite side. We currently dispense epoxy prior to second reflow on the corners of the component because the epoxy we use cures before reflow and doe
Electronics Forum | Mon Nov 16 10:50:50 EST 2009 | ppcbs
I agree customer is being overly stringent, and that their is a possibility that BGA's have voids prior to installation. If you determine that the BGA's do not have voids prior to installation I suggest you slow down your ramp speed to allow the flu
Electronics Forum | Tue Nov 24 05:23:18 EST 2009 | prodivegsr
Hi Davef, Thanks...Saw 1 of your thread that you posted : Thanks for providing... From davef : There are many possibilities: * Conformal coat is incompatible with surface residue on the board * Conformal coat is incompatible with solder mask on the
Electronics Forum | Fri Jun 11 03:14:03 EDT 2010 | muarty
Thanks Dax, We currently employ a stencil aperture design pretty much similar to that you describe. And you are correct in what you say about the thermal demands almost dictating the allowable voiding level. We have suggested to our customer that th
Electronics Forum | Thu Feb 06 11:41:40 EST 2014 | EricW
Years ago I received a sample of adhesive dots that were on tape and reel and could be pick n placed with standard equipment and withstood reflow. I have a current need for these and cannot remember a vendor or manufacturer. Does anyone know of this
