Electronics Forum | Thu Oct 03 10:02:08 EDT 2002 | davef
Your problem is likely not the Pd-Ag surface layers, but the underlying metal to which you need to wet. Either a base metal is: * Contaminated and poorly wettable. OR * A material [eg, Alloy 42 (check with magnet), Kovar, etc] that is inherently dif
Electronics Forum | Thu Mar 31 19:52:50 EST 2005 | davef
We agree with Russ that you're talking palladium instead of platinum. Your wetting problem likely is not the Pd-Ag surface layers, but the underlying metal or nickel to which you need to wet. Either a base metal is: * Contaminated and poorly wettabl
Electronics Forum | Tue Jun 07 16:19:58 EDT 2005 | davef
Q1) How to identify on good or bad ICs lead that could contribute to dewetting? A1) Distinguish between good or bad IC that could contribute to dewetting by testing for solderability, according to J-STD-002. Q2) What actions that must be taken in fa
Electronics Forum | Tue Apr 11 20:26:16 EDT 2000 | Dave F
Jeremy: Parts assembler make leads of either Alloy 42 (Invar, whatever) or copper. The solderability of these leads are protected with eutectic or non-eutectic tin/lead solder, palladium or some palladium alloy, or gold. Cuppla things to consider:
Electronics Forum | Tue May 23 20:44:13 EDT 2000 | Dave F
Sal: You and Wolfgang are spot on, but let's see if we can blow this out a bit. Before proceding to rattle on ... � PC Card. A credit card-size computer peripheral that add memory, mass storage, and I/O capabilities to computers in a rugged, compa
Electronics Forum | Thu Mar 02 20:57:16 EST 2000 | Dave F
Hong Guan: When thinking about high nickel alloys: � Kovar, Alloy 42, and Invar are generally thought of as hermetic sealing materials, because of their coalescence with glass, platabililty, and coefficient of thermal expansion properties. � Permall
Electronics Forum | Thu Mar 02 20:57:16 EST 2000 | Dave F
Hong Guan: When thinking about high nickel alloys: � Kovar, Alloy 42, and Invar are generally thought of as hermetic sealing materials, because of their coalescence with glass, platabililty, and coefficient of thermal expansion properties. � Permall
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