Electronics Forum | Wed Feb 13 09:37:01 EST 2019 | SMTA-Joe
I will look into using an oven to raise the module's temp when I have the chance. This could be our only way to use existing technology that only allows for temps below what we're seeing.
Electronics Forum | Wed Oct 14 01:17:40 EDT 2020 | SMTA-64386317
Data sheet allows of 250 DegC peak temperature and we are using below 240 DegC but still seeing high fal out. Manufacturer diagnose as BE charges loss due to heat. Hence, looking for anything extra could be done to minimize this defect. There is no w
Electronics Forum | Sat Apr 15 18:34:10 EDT 2023 | dskling
Hi. Thank you for reaching out. See below for pictures. When you turn the machine on this is the position the cutters are in, the error comes up immediately. I am located in South Jersey.
Electronics Forum | Tue Apr 24 18:21:30 EDT 2007 | flipit
Hi, The verbiage states lead finish on components and not solder used in assembly. I have found nothing that states that Swatch got an exemption. Although the 650 micron pitch spec seems to have come from the data Swatch presented in their execpti
Electronics Forum | Wed Apr 25 15:19:15 EDT 2007 | flipit
Steve, See the link below. See the out take from the link below. http://forum.europa.eu.int/Public/irc/env/rohs/library?l=/requests_exemptions/resistant_applications/hpdoc/_EN_1.0_&a=d The specific verbiage is, "This exemption request seeks to
Electronics Forum | Thu Jun 21 14:36:06 EDT 2001 | dason_c
DaveP, I never see the Level 6 component, can you describe what is the package look like, ie high pin count PBGA, component thickness? DaveF, if we can store the components in the dry environment say below 10%, can we stop the floor life clock after
Electronics Forum | Tue Mar 15 13:24:44 EST 2005 | pjc
There is equipment available to clean NC residues off low standoff devices, well below 0.8mm (0.031"), from Speedline Technologies- Electrovert and Accel. See this paper under Accel: "High Reliability Underfill Performance through Proper Flip-Chip D
Electronics Forum | Wed Oct 04 16:14:17 EDT 2006 | inds
what is your peak temp.. if you try to go too high say 225-230 deg C there is a fair chance of seeing voids.. depending on your ball size and paste volume you can get a good collapse at temps below 225deg C...
Electronics Forum | Thu Oct 01 06:22:48 EDT 2009 | rajeshwara
We approved the Reflow Profile from Cookson Solder Paste Manufacturer we are using. Now I am suspecting on method of vias designing below that QFP.There is exposed pad for that QFP and we print solder paste there , but when i see under x-ray there is
Electronics Forum | Thu Feb 10 20:02:24 EST 2011 | bandtank
Thanks for your advice. My business model is fine, but I just find it to be unreasonable that there isn't a "no frills" oven below $3500 that maintains quality. I'll spend that much if I have to as I don't want to mess around with bad solder joints o
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