Electronics Forum | Fri May 05 05:51:44 EDT 2000 | Joe
Thanks for the info. Our system is capable of holding the set limits, but since breakdowns do happen I am considering what to do. So while everything is running, we have a climatic controlled area. The min. relative humidity of 40% comes from the JE
Electronics Forum | Thu Jul 20 14:36:57 EDT 2000 | Bob Willis
Yes there will be higher process temperatures on the currently preferred alloys of tin/silver. There are not that many companies highlighting they have the solutions although many parts will be fine. If all components meet the requirements of the IP
Electronics Forum | Fri Oct 22 21:23:59 EDT 1999 | se
Tombstoning is usually oven profiling, see October 14 thread below. Aperture rules are misleading. Component mix, stencil thickness, paste factors, all contribute. Also, are you making the stencil from a paste or pad layer or from a soldermask layer?
Electronics Forum | Thu Nov 19 10:24:14 EST 1998 | Brian Co nner
Currently, I am having problems with a AMP Mictor connector at the wave process. These connectors have both SMT leads(topside) and thru-hole leads. Even though we have re-designed the board for via issues. We still see some of the SMT leads re-fl
Electronics Forum | Mon Oct 22 17:47:47 EDT 2001 | davef
We on SMTnet have danced around this component package, but there is not a "background" of knowledge in the fine SMTnet Archives. We in our company use this component package, but have not seen the problems you discuss. [We see other problems.] Th
Electronics Forum | Mon Mar 11 11:11:38 EST 2002 | slthomas
Tahnk you for posting the charts. > > They look > very useful, but I have a silly question: In > reflow problems _ What is "leaching" ? Dissolution of the component metallisation into the liquid solder. _ > What is "Halo effect" ? "...a
Electronics Forum | Wed Mar 05 04:10:34 EST 2003 | Joseph
Presently, we have one PWBA with Hall IC which required designated PWE-Carrier to hold this component from bottom. This IC only has 4 leads at one at one side, whereas no lead available at the opposite. See below diagram for detail. _____
Electronics Forum | Tue May 24 18:20:05 EDT 2005 | gregcr
Hi All, I am looking for a supplier for the hardware used on reflow SMT carrier pallets. I know that there are many vendors who can make the pallets themselves, but where do they get the locator pins or spring clips. I'm not sure if each vendor ju
Electronics Forum | Thu Nov 08 06:12:03 EST 2007 | mattkehoe
Can someone point us in the right direction? We are trying to find a formula to determine the "cubic mils" of solder we end up with after reflow. (No components during the reflow) Some of the discussions we've had about it produced the thoughts bel
Electronics Forum | Thu Apr 10 07:47:47 EDT 2008 | ck_the_flip
Stencil design and pad layout are key. Too far apart - bad. If your pad geometry is correct, try the inverted home plate. That has worked well for me in the past. That, coupled with a 5-mil stencil. With regard to solder paste, some manufacturer
