Electronics Forum | Thu Sep 15 03:07:15 EDT 2005 | LeeHoMa
hi All, I am new to this forum and got a technical problem as below. Please see if anybody can help to solve it: I am currently producing one PCB board with 2 side SMD parts and all AI component in 1 side. I try to have both side SMD part soldered(
Electronics Forum | Mon Nov 07 12:25:32 EST 2005 | Rob
Hi CW, Larger chip caps can be susceptable to cracking, but mainly this is due to handling - flexing of boards is the main culprit (the part being mechanically joined at both ends to the board). PCB's usually flex easiest along one axis, and larger
Electronics Forum | Mon Nov 07 16:31:47 EST 2005 | CW
hi Bob, Thanks for the info. I understand your comments, but I am looking for specific guidance, If I am putting chip capacitors on a .063 FR4 board, what size package should we stay away from to avoid cracking? (I realize this is dependent on h
Electronics Forum | Wed Jun 14 15:32:16 EDT 2006 | pms
We have recently started building assemblies containing 0402 components (argggg!!). Were using the TM8FC magazines and are seeing alot of miss-picks on the 0402 components. When the feeder advances the part, the part can; jump out of the tape, or tur
Electronics Forum | Wed Dec 06 16:48:42 EST 2006 | Mario Scalzo
I would be glad to help you eliminate the solder balling and beading that you are seeing. As this is a fairly common defect, I would like to forward you an Application Note that we have developed that explains the cause and possible solutions. Most
Electronics Forum | Tue Jan 23 11:37:13 EST 2007 | electronhose
Here in the Great White North, the best way to check our CM's compliance with the ESD 20.20 is to take a couple months worth of data during heating season and graph it against the outside temp swings. You can easily see how the HVAC system keeps up,
Electronics Forum | Mon Apr 23 15:44:31 EDT 2007 | flipit
Steve, You read it the same way I read it. Some of my coworkers thought that the 600 micron and under spec meant that you could use lead solder and be exempt at this component pitch. That is why I posted it on SMTNET. The exemption specifically s
Electronics Forum | Mon Aug 13 10:51:14 EDT 2007 | davef
This sounds like sales-type teaser posting, but let's see what we get. When comparing convection to IR BGA rework stations, IR stations perform poorly when: * Evaluation board has no power and ground planes. Worst case PWB as IR energy from bottom h
Electronics Forum | Tue May 20 17:09:13 EDT 2008 | davef
Sorry, we didn't do a good job of understanding your question. For more on delamination, look here: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=54655 ... but we're not so sure that this is a straight delamination issue, because: * One
Electronics Forum | Mon Aug 18 15:03:38 EDT 2008 | awegener
I'd like to get more information about pick and place nozzles. How can I learn more? ... What do the nozzles look like? Are there different shapes? Are custom nozzles sometimes used for custom parts or are the nozzles mostly standardized? What kind
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