Electronics Forum | Fri Jul 17 12:49:33 EDT 1998 | Aaron Delfausse
We currently use an ESP RMA paste. The reason that I initially posted the question was because we are conducting tests to see if this is infact the best paste for our processes. In running tests, however, certain variables, such as humidity, are ou
Electronics Forum | Fri Jul 24 12:35:56 EDT 1998 | Russ Miculich
The variance of useability of any of the pastes with a difference of 5% in your overall environment will probably not even be measurable in the difference of the paste be it RMA, Water Soluble, or No Clean. What is the printer you are using and is i
Electronics Forum | Wed Feb 18 03:11:23 EST 2004 | Sam
Should I have any concerns with operators using flux for handsoldering, straight out of a 25 ltr drum which is not even thinned dowm to the correct SG level. The flux is Alpha 615-25 RMA based and we use it in our wavesoldering process. Thanks in ad
Electronics Forum | Wed Oct 27 13:20:47 EDT 2004 | DavidB
We are producing boards with Alpha 591S RMA No-Clean paste and are coating after SMC with Dow silicone ( toluene solvent based) conformal coating. We have experienced several failures due to soft shorts ( electrochemical migration?) We have also obse
Electronics Forum | Mon Jul 20 14:47:37 EDT 1998 | Justin Medernach
| We currently use an ESP RMA paste. The reason that I initially posted the question was because we are conducting tests to see if this is infact the best paste for our processes. In running tests, however, certain variables, such as humidity, are
Electronics Forum | Mon Oct 02 10:22:13 EDT 2006 | SteveH
We are having issues with cleaning underneath leadless chip carriers due to their extreme low lying nature and I wondered if anyone else had any experience of this. Our process for years has been vapour degreasing with Triklone N, which works, but w
Electronics Forum | Mon Jul 16 21:29:03 EDT 2001 | davef
Cleaning RMA with water is bad news. It will turn your solder connections white and remove none of the RMA residues. There was a thread on removing RMA within the past two weeks on SMTnet. Check the fine SMTnet Archives. Additionally, look at M
Electronics Forum | Sat Jan 06 22:09:53 EST 2001 | Greenman
Cory, I've got a lot of experience of testing of this type. The physical (not chemical) nature of the flux residues is the crucial issue in compatibility. If you have a softer residue (either caused by a thick initial solder paste deposit, or a low p
Electronics Forum | Sat Mar 08 11:04:47 EST 2003 | Joe
Mark, You've already received some good advice from the other posters. The one thing I would add is that even if you solve your printing issues on this type of part, the relative small quantity of paste may be prone to soldering problems. Ever s
Electronics Forum | Wed Sep 15 05:15:24 EDT 2004 | Adam
I have chceked the fluxing application, I seem to be getting good consistent coverage across the board using our foam fluxing system. Good flux penetration on the top-side of the through-hole plating, as this was checked using a fax paper.There is no
