Electronics Forum | Thu Feb 16 13:03:52 EST 2006 | Tom Winchell
Assuming the AL tape shorts the wires for the thermocouple, you effectively have three junctions at the business end of the wire: wire 1 to AL, wire 2 to AL, and wire 1 to wire 2. If the temperature of the junctions wire 1 to AL and wire 2 to AL are
Electronics Forum | Mon Nov 20 10:27:01 EST 2000 | Sheng Jin
correction: Part number should be 75ALS057DW sorry
Electronics Forum | Mon May 10 20:23:43 EDT 2004 | wdlau
Hi, I am looking the practice when you are phasing in the LF wave soldering process of larger boards with Larger AL E- cap, are there any concerns about the heat resistant, is there any risk to damage the E cap as higher temp is a need for larger bd
Electronics Forum | Wed Feb 15 14:03:25 EST 2006 | samir
Robert McKeown Company makes thermally conduct Al tape. KIC did a study on which method (Kapton Tape, Aluminum Tape, Hi-Temp Solder) is the most repeatable. The study can be found in their website: http://www.kicthermal.com Al Tape placed 2nd, and
Electronics Forum | Mon Aug 24 19:53:23 EDT 1998 | J. Devrajan
Anybody know a good source to refer to for possible problems with Ti-Al reaction and what could lead to delamination at the base of a via?
Electronics Forum | Mon Jul 22 01:05:14 EDT 2002 | lysik
Try George King at SCI in Hunsville AL. the have done so much stuff for the military since 196?. Plant 1 is al about HI REL and MIL SPEC. they do small jobs as well as big jobs.
Electronics Forum | Mon Feb 12 06:02:14 EST 2007 | mk
I think Mark may be able to help you out. Mark Strickland Marshal Space Flight Center MFSC Huntsville AL PO Box 707 MS K68 Huntsville, AL 35812 256-544-7432 mk
Electronics Forum | Thu Jan 06 23:07:48 EST 2011 | essohn
Hello~ I need your expoertised experience. Do you have any experience of Saponifier influence on Al pad for wire bonding. We have a porblem of no wire bonding in use of saponifier in order to remove clean type flux. thanks in advance
Electronics Forum | Fri Nov 27 02:09:50 EST 1998 | Chi-Ting Chen
| | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is c
Electronics Forum | Fri Nov 27 02:11:17 EST 1998 | Chi-Ting Chen
| | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is c
