Electronics Forum | Mon Jun 17 09:41:41 EDT 2002 | caldon
I always look into the Support Structure (Service, Applications, Training, Project/product management) of the organization. With that said I have to give Assembleon the edge. I also like the relationship between Cookson and Assembleon. Cookson Perfor
Electronics Forum | Wed Jul 31 08:23:49 EDT 2002 | mcm4me
221C). 2D vision can very effectively detect % pad coverage, I use it on my DEK and this customer has an MPM which I also believe to be capable. Here is another fact, when the customer uses Brand X solder paste the defects due to what they call pad
Electronics Forum | Tue Aug 27 11:08:24 EDT 2002 | slthomas
We use an evaporator, so that we only have a sludge of flux residue and solder metal to dispose of via the hazmat handling service. We also route stencil washer waste water into it. We use a 30 gallon drum and have it hauled off maybe twice a year,
Electronics Forum | Fri Sep 06 15:22:53 EDT 2002 | barryg
Genny, we recently went through the same scenerio. First to consider is your budget. Second , what type of components (fine pitch, bga, chip components)that you would be placing. Also consider board size max. that you would be doing and would see you
Electronics Forum | Thu Sep 12 15:58:02 EDT 2002 | stepheno
It's been years since I worked with a Fuji. I only once resorted to the undocumented part class 255 (or whatever they call it) and that was when I was working midnight shift. The smaller nozzle working better than the larger nozzle makes me wonder a
Electronics Forum | Wed Sep 18 10:06:30 EDT 2002 | Bob M
I place 15-20 mil a lot. You need to look at your pad to apature reduction. Your stencil thickness. The type of paste your using. We use 2-5 mil reduction on each side as a general rule on fine pitch. This varies depending on pad width. We also use 5
Electronics Forum | Mon Oct 07 18:03:16 EDT 2002 | russ
David, Guess what, Today I happened to try my new sample of Kester HM531 and I also was blown away by the results! I could not find voids anywhere! (same profile etc...) One thing I noticed during my testing however was that it seemed like after I
Electronics Forum | Wed Oct 30 10:26:42 EST 2002 | Randy V.
I would perform a simple solderability test per ANSI/J-STD-002. You can do this using a compatable no-clean flux like Indium NC771 and a solder pot. If the leads wet well you do not have a solderability problem. I did not notice what plating was on t
Electronics Forum | Thu Nov 14 11:08:29 EST 2002 | bcceng
Kevin, I have done the following process to a similar problem: 1. Plug holes (even to both sides of the board) 2. Clean any flux left on the surface, especially on bottom side. 3. Apply Kapton tape to the bottom side, you mite want to apply 3 layers
Electronics Forum | Thu Nov 14 14:16:01 EST 2002 | MA/NY DDave
Hi It doesn't have to be the the microwave Rogers Duroid(spelling?) material. Rogers does make other materials. Even though the material you suggested was also one my initial thoughts, I figured it better for him to go to a shop that has current exp
