Electronics Forum | Wed Sep 26 21:31:05 EDT 2001 | davef
We agree in substance and what we are discussing is: degree and perception. There have been many useful, well thoughtout postings on SMTnet by sales types. And the intent of this discussion is to promote more of those contributions, because many sa
Electronics Forum | Tue Jul 23 12:02:17 EDT 2002 | gdstanton
Ken, Excellent discussion!!! I've also seen this problem. Spent and am still spending significant time policing. I don't think it is just a buyer issue though. There are many dimensions to the problem. Suppliers, Engineering, Manufacturing, and
Electronics Forum | Tue Feb 20 16:31:49 EST 2001 | davef
Let�s be basic. The two most common causes of BGA opens that we talk about here are: 1 Gold thickness and 2 Black pad. Given the thickness of gold that you talking about, it�s reasonable to consider thickness as the first alternative to investigat
Electronics Forum | Tue Feb 20 17:30:14 EST 2001 | billschreiber
Dave, I think we are heading toward the same objective, but from different directions. You are asking what's the cost of ownership? However, I think a question that is just as important and one that is pertinent to your current economic picture is,
Electronics Forum | Wed Feb 21 16:14:44 EST 2001 | billschreiber
120 degrees F (49 degrees C.), check the fine-pitch apertures for shape distortion (stainless steel has a very poor memory, once it expands, it doesn�t always contract back to the same position). Check for dings and dents. A good stencil cleaning pr
Electronics Forum | Wed Apr 11 16:02:21 EDT 2001 | stevearneson
Let me put my two cents into this argument..After being part of many extensive studies conducted to determine the benefits of solder paste inspection, there has never been a case where the customer concluded that paste inspection (Height or Volume)wa
Electronics Forum | Tue Apr 17 21:05:06 EDT 2001 | davef
So, we�re talkin� �bout the smaller end of a "large" paper clip after it�s unfolded once, eh? In keeping with your "nothin� up the sleeves" full disclosure, I�ll bet you�re feelin� a little sheepish about not tellin� us about: * Antenna pad dimen
Electronics Forum | Mon Jun 11 21:56:41 EDT 2001 | davef
Continuing, I�ve optioned about the uselessness of shear testing of solder connections on this forum previously. So, the points that you make about the elusiveness of developing a standard for measuring solder connection strength is well taken. I�l
Electronics Forum | Wed Jul 04 11:10:56 EDT 2001 | davef
It�s tough to say. You need enough, but you can�t have too much because you slop it all over the pads, but if you have too little � well you get the picture. There�s so many ways to get to the same place. There is no standard. It�s whatever you n
Electronics Forum | Thu Jan 27 20:34:12 EST 2000 | Dave F
Ashok: The real concern about moisture sensitivity is in plastic packaged parts. The plastic packaging used to manufacture surface mount technology devices absorb moisture from the environment. The high temperatures involved in vapor phase/reflow
