Electronics Forum: alternative material to nanya (Page 1 of 2)

Alternative to solder -CE 3103????

Electronics Forum | Tue Apr 04 16:39:41 EDT 2000 | Kevin Facinelli

Does anyone have any good information on alternative solder paste materials like the Emerson and Cuming CE 3103. I would be interested in any information anyone may have on these new materials...... Thanks, Kevin

Changing Ni/Au finish to HASL lead free

Electronics Forum | Thu Jan 06 17:33:07 EST 2011 | boardhouse

Hi Johan, Sounds like you have already gone over your product very well to reduce product cost. Switching away from Deep gold Tabs & carbon ink Key pads can save quite a bit. The only other thing to suggest would be material - Moving away from Isol

Re: Soldering to Gold

Electronics Forum | Fri Sep 17 06:01:12 EDT 1999 | Earl Moon

| | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re

Re: Soldering to Gold

Electronics Forum | Fri Sep 17 09:54:40 EDT 1999 | Brian

| | | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a

Re: Soldering to Gold

Electronics Forum | Fri Sep 17 10:09:17 EDT 1999 | Earl Moon

| | | | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However,

Re: Soldering to Gold

Electronics Forum | Fri Sep 17 15:01:05 EDT 1999 | Dave F

| | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re

Saponifier needed to stop

Electronics Forum | Sat Oct 06 08:32:09 EDT 2001 | davef

Mr. Wizard is not currently available. You get the wizzer. Maybe your dream date will show later. Get your own lab tests done. Show your potential customer that your boards are clean. That�s the issue. The issue is not how you go about cleaning

Coatings to prevent water ingress

Electronics Forum | Sat May 24 21:49:24 EDT 2003 | ramanandkini

We have an electronic circuit with a miniature stepper motor, quartz crystal, Electrolytic capacitor,chip resistors and few smt LEDs. The PCB material is CEM1 with SMOBC and HALS finish. This circuit is assembled in a plastic casing and goes in to a

Re: equipment to vacuum seal parts

Electronics Forum | Thu Oct 01 16:46:50 EDT 1998 | Dave F

We are trying to eliminate/minimize the baking process for high lead-count ICs. We would like to reseal packages containing these parts to minimize exposure to humidity. Anyone have or know of a way to reseal or vacuum pack parts? Any suggested eq

Micro BGA pads, adhesion to laminate

Electronics Forum | Thu Jul 10 09:55:47 EDT 2003 | davef

A reading of the pictures is: A1: Looks like pad [B1] is smaller than the other pads. It�s weird that the pads are such different colors. A2: Looks like pad [B1] is smaller than the other pads. Solder mask opening [B1] is misregistered and seems s

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