Electronics Forum | Tue Jun 15 13:36:30 EDT 2004 | John S
We are launching a new product and are fairly new to reflow soldering. A concern that has arisen is a fairly consistent solder ball that forms at an electrolytic capacitor. We changed to a homebase aperture design on our passives to eliminate mid-c
Electronics Forum | Wed Apr 22 21:21:06 EDT 2015 | comatose
We see this from time to time. Usually, one of the leads of an electrolytic is attached to a ground plane, and the other to a trace. The ground plane acts as a big heat sink and reflows significantly later than the trace. If you have glue in your li
Electronics Forum | Thu Jun 24 11:54:36 EDT 2004 | rickw
many solder-ball issues can be resolved by reducing the aperture size, usually 10 to 15% reduction will work. If the aperture size is the same as the pad size paste tends to be squished out under the part, paste off pad under the part will liquify a
Electronics Forum | Wed Apr 22 08:40:18 EDT 2015 | markhoch
Hi Myriam, I think we may need some more information. Is the Electrolytic (Aluminum) Capacitor placed more than once per board? If so, are all locations twisting? This would typically be caused by a thermal imbalance that could be design induced. (u
Electronics Forum | Wed Jun 19 05:16:21 EDT 2002 | hany_khoga
Dear all: I wonder how to avoid cracking the BGA if I want to remove it from the PCB assembly, re-ball it and solder it again. I need an answer considering: 1- The assembly could have been exposed to the ambient humidity for a long time. 2- The as
Electronics Forum | Mon Aug 28 12:41:35 EDT 2000 | JAX
MoonMan, I'll take a crack at the list. Feel free to answer the ones I don't! 1. Solderability is a parameter which indicates how well a component can be soldered. As far as Solder Termination Coatings go, here are some up�s and down�s of a few. Ha
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