Electronics Forum | Thu Jun 19 09:33:09 EDT 2008 | stevenvl
Hi, I'm having issues with boards sticking/jamming along the line, as well as what seems to be excessive wear along the guide rails. The boards are an Alumina Ceramic material and the rails differ by machine, but include anodized aluminum, steel, de
Electronics Forum | Mon Oct 07 16:07:22 EDT 2019 | ddfreeze
I have a silver aluminum z axis sensor that is not mounted, I need to know where it goes. The sensor has a picany rail type mount, triangular rail insert type. It is located in the board support nest area. Seems like it might go on the inside of the
Electronics Forum | Fri Nov 06 08:50:07 EST 2009 | jeffreyj
adlsmt - I do apply paste (Kester EP256) by hand to the boards now with 5 mil thick stainless steel stencils. A few of the parts almost always need rework, though, either because I didn't place them accurately or there's too much paste, or it got sme
Electronics Forum | Thu Jun 19 13:29:18 EDT 2008 | gregp
Hi Steven, Those types of substrates generally require special conveyoring for the reasons you stated. The best material would be hardened steel although you might be able to use hardcoated aluminum. The process is similar to anodizing but the fini
Electronics Forum | Thu Oct 11 17:44:30 EDT 2001 | aaelect
OK, OK. 672 ball BGA. The pcbs are PC Card bus size and are .015 thick. There are 3 on a panel with about 1/2" between and rails. The aluminum plates are about 3" by 7". There are 3 cutouts which allow for the parts from either side to protrude du
Electronics Forum | Wed Aug 07 08:43:32 EDT 2002 | davef
Comments on copper plate temperature monitoring are: * Some people use this type of temperature monitoring to start the day as an element of an oven capability measurement and monitoring program. * Using a copper or other metal plate, like aluminum,
Electronics Forum | Tue Nov 20 09:50:07 EST 2007 | rgduval
Only on the bottom side? Run that side first . We usually determine our run process based on the heaviest components, and propensity for falling off during the second reflow process. If there's only the one BGA on that side of the board, we'd tend
Electronics Forum | Sat Jul 10 02:47:27 EDT 1999 | Scott
| | | Hi! | | | I'm a process engineer attempting to do a capability study on our existing convection reflow oven - Heller 1500. It was recommended by an independent consultant to do at the very least, load testing, process ready testing, and board
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