Electronics Forum: american standard circuits (Page 7 of 28)

ODB++ vs Gerber file

Electronics Forum | Mon Dec 02 20:53:29 EST 2002 | davef

Gerber[R] Data (File). Used in directing a photoplotter during printed circuit board and stencil artwork fabrication. Gerber Scientific Instrument Company used to be the dominant producer of the photoplotters used for "shooting" film, back when mec

Flex Circuits reflowing

Electronics Forum | Wed Jul 16 09:55:05 EDT 2003 | swagner

To answer the first post after my initial response we haven't published any of our lead free data since it is proprietary, sorry. As for the nitrogen cabinet it has been proven that over time the Gold plating can build up a layer of oxides that can

Soldermask thickness

Electronics Forum | Wed Oct 01 21:22:37 EDT 2003 | ramanandkini

We have a 1.6 mm thick automotive PCB board of size 35x70mm. One of our vendor has given us a batch with lesser soldermask thickness 5~8 microns. Will this affect the circuit board on a long term. What should be standard for the soldermask thickness?

Wave Solder: Flux Validation

Electronics Forum | Tue May 18 14:37:11 EDT 2004 | Glenn

Hey guys, I was wondering if there was a standard set of tests used to evaluate flux chemistries for wave soldering. For several years, we've been spraying Alpha 871-25A flux from Alpha Metals onto our printed circuit boards with relatively good suc

Looking for expert opinions, Solderability

Electronics Forum | Fri Jul 23 05:25:20 EDT 2004 | greg york

Got to agree with John on this, get a stencil cleaning wipe something a little more potent than standard IPA and wipe the surface thoroughly, this should produce a green residue of solder resist. If this does happen then ask your PCB vendor to look a

gold wire bonding

Electronics Forum | Wed Dec 28 03:33:31 EST 2005 | sparrow

I would like to know if ENIG is widely used for the thermosonic gold wire bonding or this application is an exotic one. And I also wold like to talk to someone who uses printed circuits with ENIG finish for such an application. I do not quite underst

Baking planars after new BGA placed.

Electronics Forum | Mon Aug 14 20:37:03 EDT 2006 | davef

JEDEC defines packaging, matrix trays, tape and reel, and like whatnot. You need to be searching ANSI and IPC. Find these documents: * ANSI/J-STD-020, Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices *

Yield on 0402 SMT Printed Circuit Board Assemblies

Electronics Forum | Tue Jan 02 17:39:45 EST 2007 | fastek

Personally I wouldn't care what the industry standard is....if I was producing something where 15 out of 100 failed, it would not be acceptable. Determine why this is happening and fix the problem and don't be concerned with what anyone/everyone el

Removing Markings from Devices

Electronics Forum | Thu May 01 18:17:09 EDT 2008 | jmelson

I just got done analyzing an old piece of gear with relabeled parts. We had a schematic of the boards, with no info other than the OEM's part numbers and the way the chips were interconnected. It took me no more than 15 minutes with a couple databo

How many times can a component go through reflow oven?

Electronics Forum | Thu Sep 03 11:38:28 EDT 2009 | dyoungquist

I'd be more concerned with the pcb itself then I > would be with standard SMT components. Are you > using a PCB with a high Tg? (170 degrees C or > greater) The circuit board material is NP-170B (Nan Ya Plastics Corporation). It has a Tg of 170


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