Electronics Forum | Thu Jul 05 17:40:21 EDT 2012 | ck_the_flip
DaveF, What is your prediction if one tries to put a solder iron to it? Will the component bridge? I know hot-bar soldering is more common for things like Flex Circuits (with silver-filling epoxy), etc. and not so much for things where standard so
Electronics Forum | Tue Oct 03 17:08:31 EDT 2023 | assuredtech
What Is FR4 Substrate Material? FR4, also written as FR-4, is both a name and a standard rating. The name is applied to the fiberglass-reinforced epoxy-laminated sheets used in printed circuit board manufacturing. However, the name also functions as
Electronics Forum | Wed Dec 22 18:09:07 EST 2004 | kmorris
At a previous job I had been taught that when reflow soldering polyimide flex circuits, it was necessary to pre-bake them before reflow soldering to prevent delamination. Our procedures said that there must be a 1hr bake prior to reflow, and the flex
Electronics Forum | Sat Jun 11 07:58:17 EDT 2016 | davef
IPC-2252 - Design Guide for RF/Microwave Circuit Boards IPC-2251 - Design Guide for the Packaging of High Speed Electronic Circuits IPC-2141A - Design Guide for High-Speed Controlled Impedance Circuit Boards IPC design standards https://portal.ip
Electronics Forum | Fri Oct 08 18:26:19 EDT 1999 | Dave F
| | Is there an IPC Standard stating the max. number of times that a PCB can pass through a reflow or wavesolder machine without having solder mask breakdown. | | | | PCB is FR4 | | Solder Mask is LPI | | Reflow and W/S Profile = Standard | | | | t
Electronics Forum | Fri Mar 26 12:26:31 EST 2004 | Mike Konrad
Hi Patrick, With all due respect, it is easy to quantify zero. You made a claim that your flux produces ZERO residue. There are several industry-standards (IPC and Military) of determining the cleanliness of post-reflowed circuit assemblies. Th
Electronics Forum | Thu Mar 21 09:23:35 EDT 2024 | alishakihn
Good morning! I'm sorry to hear about the anomalies you're experiencing with your inline wash. Dealing with foaming issues can be challenging, but I'll do my best to provide some suggestions to help you troubleshoot the problem. 1. Check the Water Q
Electronics Forum | Sat Dec 12 12:03:59 EST 1998 | Dave F
| DO you know of an Industry Standard that describes solder paste geometries requirements? | Lyle: The industry standard that describes solder geometries requirement is IPC-A-610. There is no industry standard that describes how solder paste shoul
Electronics Forum | Thu Dec 03 11:01:03 EST 1998 | Walter Cole
Hi Scott, I am a regional manager for Multitroniks and would be glad to assist you with additional information on the systems you are asking about. Both of these machines can be demonstrated for you any time at our factory in Warren, NJ. Below I'l
Electronics Forum | Tue Jan 11 09:47:01 EST 2000 | Dave F
Abbas: Sources of information on DFM/DFT are: � "SMTnet Express" articles on DFM by Earl Moon � IPC-D-279, 'Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies' � Books in SMTnet and SMTA book stores � Other examples ar
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