Electronics Forum | Wed Jun 19 08:51:49 EDT 2002 | davef
Try this: * Remove PTH components that cannot resist baking like, plastic sockets & electrolytic capacitors. [NOTE: It may be econonomic to sacrifice some of the PTH components that cannot resist baking.] * Bake the board. * Remove, reball, and repla
Electronics Forum | Mon Jan 26 09:44:13 EST 2004 | Dave Chapman
Dave , I am working with a West coast Liquidator, Which has a very good condition Amistar 1998 MT 5530LQ S/N 13908-87162 , Machine has 50 feeders 80 percent are 8mm balance are 12,&16's Has lazer centering , fiducial camera, and upward looking
Electronics Forum | Thu Jun 20 16:24:59 EDT 2002 | blnorman
At the OSHA training institute, our instructor stuck an electric drill in a bucket of water to demonstrate what proper grounding will do. Personally I wasn't going to try it. All our fluxes are no-clean, and are IPA based. Granted we used aqueous
Electronics Forum | Thu Jun 20 10:48:56 EDT 2002 | Hussman69
When you ask for data in terms of rework, do you want reflow solder yields versus wave solder yields? Or do you want repair data from each process, or yield data that shows actual glue defects from screen printing versus solder paste screen printing
Electronics Forum | Thu Jun 20 16:59:57 EDT 2002 | davef
We look at gluing and pasting second side components as two different processes, NOT alternative processes. Given our drothers, we'd paste / place / reflow all day long, before we'd want to glue. We glue because we have to glue. The main driver to
Electronics Forum | Thu Jun 20 19:27:28 EDT 2002 | surinder
Hi Dave, I am agree with you,but one of my customer want to know the difference in terms of rework/Quality,if we go for Glue process in place of solder paste and want to see some data We have board ,which have Through hole components and smt comp. on
Electronics Forum | Fri Jun 21 13:05:58 EDT 2002 | surinder
Hi Stephan, Thanks,Yes there are thieving pads on Ic's .Also the two QFP, which mention,that will be removed by modifying the design in long run ,if the results/Yields are okay as with Glue as Compared to solderpaste process. Yes you are right here,b
Electronics Forum | Wed Jun 19 22:03:23 EDT 2002 | davef
If you can assemble flawless products with these boards, do not be concerned about post-assembly quality issues. There is no current related specification in the US. Although, there may be some old military specifications that apply, but you would
Electronics Forum | Thu Jun 20 03:29:56 EDT 2002 | Josef
I would like to ask you for help. We use mixed technology and we need to protect SMT components in double Wave. Currently we use the carrier for protection of this component. In this case this procces is not possible to use it due to gap between SMT
Electronics Forum | Thu Jun 20 08:31:36 EDT 2002 | davef
You can use a peelable, rather than a water washable, temporary solder mask? Points are: * Vinyl peelable is preferred over latex, because of lower residues. You should be very concerned about this since you are probably running a low residue proce
