Electronics Forum: amps (Page 5820 of 7901)

Smt 'pick and place' machine issues

Electronics Forum | Wed Nov 29 08:25:28 EST 2006 | aj

Hi, I work mainly with Fujis but have some experience with Panas. If you are seeing components upside down on the board it is feeder related . If you are seeing poor alignment across the board , firstly I would check the xy table for alignment. Mak

Flux residue cause high false reject at ICT

Electronics Forum | Wed Nov 29 01:25:53 EST 2006 | callckq

Dear All, I have 1 product that using solder bar from vendor called Asahi. After wave process, we found quite a sticky flux residue remain on the board. Eventually, have huge impact on our ICT fisrt pass yield(FPY). Current FPY is a the range of

Flux residue cause high false reject at ICT

Electronics Forum | Wed Nov 29 11:56:10 EST 2006 | CK the Flip

For the better part of my career, I've battled with ICT guys on so-called "flux residues" on their test probes, and this was when using NO-CLEAN, 2% to 5% solids tops, flux. People don't understand that ICT probe maintenance is an inherent part of

Flux residue cause high false reject at ICT

Electronics Forum | Thu Nov 30 19:55:30 EST 2006 | greg york

This may be worth checking out are you sure it is flux residue and not undercured plasicizers coming from solder resists due to the higher Lead Free temperatures killing the undercured resist, this causes many no faults found and bridging, solderball

Flux residue cause high false reject at ICT

Electronics Forum | Mon Dec 18 04:03:30 EST 2006 | greg york

Good solvent wipe will normally show some discoloration of the same colour as resist, but not scientific enough as you cant gauge the amount coming off, ideally none. But is an indicator of the issue. I have been meaning to do a swab with an indicato

Baking of MSD devices

Electronics Forum | Wed Nov 29 01:46:10 EST 2006 | hanocete

Hi! to all, Here in our company, we sometimes received BGAs and ICs that were packed poorly(not sealed), and no MSL level written to it from our suppliers, now we subject the material for baking before using it. We use J-STD-033B table 4-1 as our cr

BTU paramax 150

Electronics Forum | Thu Nov 30 10:38:39 EST 2006 | billwestiet

You are cooling too fast, and some flux and paste is worse than others... Can you control your cooling zones? Water Temp (higher)? Or Water Flow (less, effectively less cooling)? Changing water temp is prefferable over flow if you can do it. I h

BTU paramax 150

Electronics Forum | Thu Nov 30 16:31:40 EST 2006 | techgonecrazy

This has been a problem from the start. I used a digital flowmeter to check exhaust and both sides are pretty even, however, I do not know if its exhausting too much or not enough, just going on the PE specs...but then again...do they really know. I

Ok gurus got a question?

Electronics Forum | Thu Nov 30 08:15:16 EST 2006 | jdengler

If you define cycle time as the time it takes to complete one board it is a useless number. What you need to know is the time it takes to complete one board and start the next board. This means first fiducial on first board to first fiducial on th

Strange empty ball on chip component after reflow

Electronics Forum | Thu Nov 30 08:09:19 EST 2006 | INGE

Hi everybody, The matter is this: after reflow, on top side leads of chip components (resistor 0805)appear some empty balls of solder. In some cases this thing is only on the lead and the solder joint seems good, in other cases this empty ball is als


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