Electronics Forum | Fri Apr 13 17:11:12 EDT 2007 | jmelson
Even though this is a "no clean" flux, are you (or the customer) cleaning the boards? If this is truly a low signal level device, there is no way you will get away without cleaning the flux residue. I do a lot of low-level hardware, and we have to
Electronics Forum | Fri Oct 27 21:39:48 EDT 2023 | sarason
Stepper motor drivers from Analog Devices? Send an email to Analog Devices and talk to a rep or go on the EEVBlog Forum and ask in https://www.eevblog.com/forum/beginners/ or https://www.eevblog.com/forum/projects/ regards sarason
Electronics Forum | Sat Jul 04 15:34:12 EDT 2020 | sara_pcb
Hi, I am designing a PCB which consist of Instrumentation Amplifiers, Programmable Gain Amplifiers, Switched Cap Filters, FPGAs & many ADCs. Involves low level Analog signals. How to patrician the layout so Analog & Digital signals do not interfere.
Electronics Forum | Tue Nov 09 17:26:13 EST 1999 | Dave F
Horace: You weren't real specific about the set-up of the two machines. So what's the diff man?? Big dross generators are: 1 R Woodgate says that pump speed is the biggest driver to dross production 2 Chrys uses low dross cast bar: Alpha HiFlo 3
Electronics Forum | Tue Mar 25 07:33:46 EDT 2008 | davef
References [Analog Devices] 1) "Surface Preparation and Microscopy of Materials" B Bousfield, John Wiley & Sons, LTD., West Susse_, England, 1992 2) "Metallography Principles and Procedures" Leco, Corp. 1992 3) "Buehler Dialog, Microstructural Analys
Electronics Forum | Wed May 06 15:05:00 EDT 1998 | Justin Medernach
| | Dear Freinds, | | DOES ANY ONE OF YOU WILL BE KIND ENOUGH TO GIVE SOME INPUT ON DOUBLE SIDE REFLOW OF COMPONENTS WHAT ABOUT BOTTOM SIDE COMPONENT HOLDING DURING 2ND SIDE REFLOW? ANY IDEA OTHER THAN USING SLDERPASTE WITH OFFSET MELTING POINT, EPOX
Electronics Forum | Mon Apr 30 00:06:56 EDT 2007 | grantp
Hi, I can understand the problem of export from the US to Syria, as we are not US based, however almost all our components are supplied by US based companies, and are from US based manufacturers such as Analog Devices, National Semiconductor, ST Ele
Electronics Forum | Wed Aug 13 21:03:01 EDT 2003 | davef
Your dust collection / humidity / ionic path concern is reasonable. Consider applying your conformal material thick enough to form a good barrier between the device edge and the board, similar to what you do for QFP. [Admittedly the QFP is not a pre
Electronics Forum | Wed Apr 24 21:35:34 EDT 2002 | davef
Ooooo, much better. Tough to say, because of all the variables [ie, different materials, moisture level, temperature, etc]. Plastic encapsulated devices, especially IC, absorb water from the air, which is violently released during soldering. Typica
Electronics Forum | Tue Nov 01 14:46:31 EDT 2011 | davef
Agilent TestJet Technology White Paper In the early 1990s, the testing of digital parts became problematical. Previous in-circuit test techniques sought to ensure a correct, functioning part by applying digital patterns, called vectors, to the input
