Electronics Forum: analysis (Page 7 of 100)

capacitor leakage

Electronics Forum | Fri Jul 12 08:26:51 EDT 2002 | davef

We sent the sectioned capacitor to our supplier for analysis. So, the results of their analysis is probably in a file drawer someplace.

Stack up Analysis

Electronics Forum | Thu Aug 05 11:40:24 EDT 2004 | Dhanish

How do you perform stackup analysis for mechanical parts?I refer to some documents and it is very detail.

Solder joint Analysis

Electronics Forum | Fri Dec 31 10:16:22 EST 2004 | Brad

Can anyone recommend a company thats local to New England that does extensive solder joint analysis.

fmea

Electronics Forum | Fri May 21 12:13:11 EDT 2010 | davef

Failure Modes and Effects Analysis (FMEA): http://en.wikipedia.org/wiki/Failure_mode_and_effects_analysis

Wave Soldering to ENIG Pads

Electronics Forum | Wed Sep 05 08:06:08 EDT 2007 | davef

The gold needs to go into the solder so the solder can form a connection between the the component and the nickel under the gold. The gold will disperse into the solder. Most of it will remain in your solder pot after board processing. Assess the c

PC Board Guidelines

Electronics Forum | Thu Sep 20 15:05:20 EDT 2007 | jax

You can specify the prepreg thickness in the stackup. Once you have specified it somewhere, make your PCB manufacturer build to it... and prove it through cross-section analysis. Depending on the Board cost, we require a cross-section and analysis d

Design for Assembly

Electronics Forum | Wed Aug 08 07:17:08 EDT 2018 | milena_k

Hi, do you know any company who provides Design for Assmbly analysis of PCBA assembled in the housing (with other components like gears, radiators, screws etc.)? By DFA I mean analysis from the mechanical side, in range of dimensions, tolerances, me

Solder Analysis

Electronics Forum | Tue Jan 17 11:28:21 EST 2006 | aj

Supplier is Alpha...

MATERIAL ANALYSIS

Electronics Forum | Mon Sep 27 13:04:22 EDT 1999 | Chuck B

I AM LOOKING FOR A HOUSE IN NEW ENGLAND AREA IF POSSIBLE BUT NOT NECESSARY, WHO ARE EXPERIENCED IN DOING MATERIAL ANALYSIS ON THE INNER END CAPS OF CERAMIC CAPACITORS. PLEASE ADVISE THANKS IN ADVANCE

Black pad defect on gold plated boards

Electronics Forum | Fri Aug 22 09:49:31 EDT 2003 | davef

Ask your supplier for a corrective active and failure analysis of the boards. In parallel, send the boards to a failure analysis laboratory to determine the material on your gold pads. Take your work to another supplier.


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