Electronics Forum: analysis laboratory (Page 1 of 6)

Component failure analysis

Electronics Forum | Tue Jul 19 21:24:04 EDT 2005 | davef

This is a bit dated, but it'll give you a starting point. test lab failure analysis IC; Accurel Materials Analysis Group (FIB, FESEM,TEM) 785 Lucerne Dr Sunnyvale, CA 94086; 408-737-3892 Fax 3916 Suzanne Francisco X146 suzannef@accurel.com test la

What to look for in a BGA Lab analysis

Electronics Forum | Thu Mar 26 19:13:15 EDT 2015 | vladig

Right. That's what we normally do for our customers in order to just qualify a process. I'd just add X-ray, particularly on a large BGAs. Regards, Vlad SENTEC TESTING Laboratory Inc.

Wire bond failure

Electronics Forum | Thu Jan 15 21:16:18 EST 2009 | davef

Our first impulse would be to blame someone else. We'd send some of the DPAK from inventory to: * Supplier * Outside failure analysis laboratory ... for delidding and analysis

Black pad defect on gold plated boards

Electronics Forum | Fri Aug 22 09:49:31 EDT 2003 | davef

Ask your supplier for a corrective active and failure analysis of the boards. In parallel, send the boards to a failure analysis laboratory to determine the material on your gold pads. Take your work to another supplier.

non-wet on 0402 mounted on OSP & lead free paste

Electronics Forum | Sun Oct 19 08:11:12 EDT 2008 | davef

While you're waiting for others to reply to your question on component analysis laboratories, search the fine SMTnet Archives to find posts like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=35636

Is This Corrosion?

Electronics Forum | Tue Jan 20 17:00:05 EST 2009 | davef

For lack of a better description, we'd say, "Yes, that could be corrosion." Regardless of what you call it, it looks nasty and should not be allowed on bare boards of any sort. Based on your picture, we can't tell you whether it's related to your con

Oxidation

Electronics Forum | Mon Nov 17 21:30:10 EST 2003 | davef

Odds are that all of the completed product had corroded leads, if the components came from the same load / were processed similarly. ... but the issue is NOT corroded leads. The issue is well soldered connections. * If the solder connections on the

Cleaning no-clean residue

Electronics Forum | Tue Apr 17 12:39:29 EDT 2001 | davef

Continuing with Steve's comments, the true measure of whether or not residues [NC or not] are good or bad is found in the results of an laboratory analysis of the residues and an assessment of the impact of that level of residue.

Cleaning procedure when WS609 flux is used

Electronics Forum | Mon Jan 21 19:22:38 EST 2008 | davef

In your situation, the issue is the compatibility of your flux residues and the encapsulant that you choose. First, contact your encapsulant supplier for advice. They've likely been down this road with other customers and may be able so save you som

Need help on PCBA Cleanliness Standards and Specs

Electronics Forum | Tue Nov 25 22:25:24 EST 2003 | davef

We had a similar problem on the high impedance front end of a MOSFET amplifier a few years ago. If your situation is like ours, the issue is not what a consensus specification [like J-STD-001] defines as an upper limit, but what your product is defi

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