Electronics Forum | Tue Jan 10 08:34:45 EST 2006 | jax
I am not sure how you know you have "Black Pad"... Did you have one of the boards Cross Sectioned and Analyzed by an outside source? If yes, I would go back to the Fab House for the total cost of the product you currently have at the full 200 piece q
Electronics Forum | Thu Feb 23 12:17:47 EST 2006 | mafc65
As Russ say, you can buy kits from Practical components and make your tries, the send those pcb's to your solder paste vendor for analysis.I am using Senju Lead free solder and I send boards to them then they cut the board and analyze your solder con
Electronics Forum | Wed Jun 07 22:33:50 EDT 2006 | Bolos
first: what is your problem after reflow? second: a good rule of thumb is a tolerance of 1 mil. for example..if you got 5 thou stencil thickness then your range of thickness is 6-/+1 thou.. then you just improve after you get your height data and ana
Electronics Forum | Thu Jan 18 14:03:09 EST 2007 | pima
Hello everybody!! I would like to know what kind of tool do you use to analize pick-up error rate at CP and IP fuji machines? Is it special kind of software or you use some customized solutions? Im thinking about writing some kind of database based
Electronics Forum | Fri Oct 05 18:16:20 EDT 2007 | bigdaddysoy9
Thanks for the replies. We have been doing the same thing. There's green everywhere and I'm getting sick of that color. I like Hussman's idea but most of our operators are pretty kinky and they would probably enjoy being beaten with a big stick. Anyb
Electronics Forum | Wed Feb 20 19:59:10 EST 2008 | pnguyvu
An experienced stencil designer suppose to check gerber data before making stencil it take 5 minutes to do this easily in computer after that analyze components if there's any critical parts in order to modify the aperture at USA STENCILS INC we have
Electronics Forum | Thu May 01 18:17:09 EDT 2008 | jmelson
I just got done analyzing an old piece of gear with relabeled parts. We had a schematic of the boards, with no info other than the OEM's part numbers and the way the chips were interconnected. It took me no more than 15 minutes with a couple databo
Electronics Forum | Mon Sep 08 09:59:56 EDT 2008 | vladig
Here we go with another "solderability problem". How do you know the pads on the bare PCB are oxidized? Just based on its colour? If that is the root cause, then why ohter parts on the same board are fine? If you want to solve the problem, get it's
Electronics Forum | Wed Feb 04 08:00:30 EST 2009 | milroy
Hi, It depends on the stencil thickness, aperture size and the component footprint. For exampl if you have a PCB with QFP,CSP,QFN & BGA parts then this underwiper is not useable because you will still find solder cream deposits in the apertures aft
Electronics Forum | Thu Aug 20 21:52:22 EDT 2009 | davef
It's a safe bet that your solder alloys will merge and form a proper solder connection at ~230*C for 15 to 20 seconds. At process conditions with less time and temperature, it's a lot of bla-bla-bla. In order to understand the quality of the solder c
