Electronics Forum | Wed Mar 28 20:00:03 EST 2001 | manish01
Hi. Does anyone out there know who the significant equipment manufacturers for annealing are !!!. I need this information desperately and your help will be greatly appreciated. Regards, Manish
Electronics Forum | Wed Aug 23 16:40:30 EDT 2000 | Dr. Ning-Cheng Lee
During the second reflow, the solder remelts and resolidifies. In general, the reflow temperature is not high enough to erase the microstructure developed during the first reflow. As a result, the net effect of a second reflow typically is grain coar
Electronics Forum | Mon Feb 05 10:21:21 EST 2007 | davef
Thermal conductivity [W/m-�C] * Silver: 418 * Aluminum: 403 * Copper [rolled annealed]: 392 * Copper [electrodeposited]: 392 * Gold: 297 * Nickel: 90.7 * Tin: 73 * SAC: 73 * Castin: 57 * Pb37Sn63: 51 * Lead: 35 * Epoxy, phenolic: 25-75 * Conformal co
Electronics Forum | Mon Jul 16 10:15:07 EDT 2007 | fredc
I am surprised you have a problem with the berilium copper. Properly heat treated it should be harder than any of the 300 series nonmagnetic stainlesses. Many of the heat treatable stainless can be harder and more wear resisting than the berilium cop
Electronics Forum | Wed Apr 12 20:41:31 EDT 2000 | Dave F
Russ: That�s a pretty stand-up postin� bud. It�s neat that you can root-out that dirt. We couldn�t dig-up that stuff, if they threatened to shoot the dog. You could be correct about using convex for waving. We don�t wave RNET as Philips suggests
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
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