Electronics Forum | Fri Jun 06 13:03:01 EDT 2014 | asksmt
Hi All, i have footprint 2X5 RA HEADER 2MM spacing in design. I am using about 9 mils of annular ring on top side and about 12 mils of annular ring on bottom side. refer picture attached. we are having solder short issues during wave solder so was
Electronics Forum | Wed Jun 15 02:09:50 EDT 2016 | twhoo
Anybody see this kind of reject. The thru hole ring turns black (certain area) after wave soldering. The affected area cannot be soldered. Manual touh up is also not possible. Anybody what is the cause of this? Any lab test to prove what is the ite
Electronics Forum | Mon Aug 29 08:44:57 EDT 2016 | jrrt_williams
As an OEM repiar tech I would run into "Black Pad" on occasion, though mostly on surface mount pads. The only way I could remove the oxidation was to apply water soluble flux and add solder, then wick away the excess. This left me with a suitable s
Electronics Forum | Tue Aug 02 15:02:50 EDT 2016 | davef
ASPIS (Advanced Surface Protection for Improved Reliability PCB Systems) The three year Aspis ‘Research for SMEs’ project has been conducted to address problems found with the nickel gold (ENIG) solderable finishes that are used by the electronics in
Electronics Forum | Tue Aug 02 15:03:37 EDT 2016 | davef
On a previous black pad experience we soldered a wire to a fiducial and did a pull test to failure. On the black pad board the wire and solder pulled of clean leaving the fiducial on the board. On good boards the copper came off with the wire. If you
Electronics Forum | Mon Aug 22 22:40:52 EDT 2016 | twhoo
analysis report is as attached. Pls let me know what you think of the root cause of this issue? Can i conclude this is a black pad at thru hole ring with a root cause of contaminated gold
Electronics Forum | Thu Jun 30 03:14:34 EDT 2016 | andrzej
Looks like "black pad" issue. More about this here: http://www.ipc.org/feature-article.aspx?aid=Black-pad Definitly PCB supplier need to improve the process.
Electronics Forum | Mon Aug 22 23:22:29 EDT 2016 | twhoo
i also notice the carbon and oxygen is high on the defect? Why is that?
Electronics Forum | Mon Jun 27 11:01:58 EDT 2016 | mufflerbearings
From the pic, it looks like you have a bad board; ENIG process issue. It used to be called black pad for SMT but I'm sure it's the same condition for T/H. Any good electronic lab should be able to id the black stuff. I would also send raw boards bac
Electronics Forum | Tue Jul 05 18:13:03 EDT 2016 | padawanlinuxero
As my fellow members are saying this is a bad mfg process, you need to talk to your supplier to see if theres something contaminating the ENIG plating, this is a very critical issue you must act on it before some problems arise in the field where can
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