Electronics Forum: ansi j-std 001 (Page 1 of 31)

Humidity in SMT room

Electronics Forum | Fri Feb 17 07:43:09 EST 2006 | davef

ANSI-J-STD-001 says words to the effect: 18-30*C, 30-70%RH

SMT Production Floor RH Control

Electronics Forum | Wed Jan 10 21:47:39 EST 2007 | davef

ANSI-J-STD-001: 18-30*C, 30-70%RH

Information on spec on building a SMT area?

Electronics Forum | Tue Sep 02 22:23:27 EDT 2008 | davef

ANSI-J-STD-001: * Temperature and Humidity * Lighting * Maximum noise limit * Eating, drinking, and using tobacco products in the workarea ANSI/ESD S20-20-1999, Table 1- ESD Control Program

Re: Solder Class 1,2,3

Electronics Forum | Thu Oct 05 09:01:19 EDT 2000 | LarryK

The IPC-A-610 has the Acceptability requirements and the ANSI/J-STD-001 has the Requirements for soldering. Both deal with the requirements for the individual classes. Both of them are published by IPC and can be purchased in lots of places includ

SMT Rework

Electronics Forum | Mon May 21 10:22:29 EDT 2001 | larryk

Sean, Are you sure that you don't mean IPC instead of ISO? If so, the the IPC-A-610 is what you are looking for. If you are doing soldering rework, then look at the ANSI/J-STD-001 too. Larry

Re: Humidity Of Assembly Area

Electronics Forum | Thu Nov 04 15:28:53 EST 1999 | Dave F

Whoa Scott, them's serious numbers!!! ;-) But then again, it depends on what you're doing doesn't it? Chris: Try ANSI-J-STD-001, which says 18-30�C, 30-70%RH Good luck Dave F

Voids in solder fillet

Electronics Forum | Thu Apr 17 22:20:39 EDT 2003 | davef

Q1: Industry standard detailing solder joint quality? A1: ANSI/J-STD-001 - Requirements For Soldered Electrical & Electronis Assemblies is the mutha of industry standard detailing solder joint quality.

Re: No-Clean Solder Paste

Electronics Forum | Sun Apr 05 19:02:34 EDT 1998 | Graham Naisbitt

Peter, Take a look at IPC-ANSI J-STD-001A and B, J-STD-004 and I think, 005/006 which cover solder paste (?) I think. Whatever, they do reference one another. | Question: Whatparameters are used to determine "good" Solder Paste? What reference doc

External Factors to be controlled during assembly

Electronics Forum | Sat Sep 29 08:19:16 EDT 2001 | davef

The current version of ANSI/J-STD-001, "Requiremnts For Soldered Electrical & Electronis Assemblies" is C [3/00]. The following sources can help you: * IPC http://www.ipc.org * SMTA http://www.smta.org * Document Center http://www.document-center.c

Drinking Water In Production

Electronics Forum | Mon Feb 07 14:54:30 EST 2005 | davef

Industry assembly procedures say: * ANSI/IPC-A-610, in section 3.4.1, as a guideline, indicates that "There must not be any eating, drinking, or use of tobacco products in the work area." * ANSI/J-STD-001, in section 3.7, "Eating, drinking, and/or u

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