Electronics Forum: any (Page 760 of 1648)

Automated board labeling system.

Electronics Forum | Thu Dec 13 17:31:59 EST 2007 | fredc

One of my customers use Amistar machines. The machine goes in the line and prints labels for each individual board and places the finished label on the board as it goes through. They have several of the machines, so they could have gotten something e

Baking components at 70 degree

Electronics Forum | Wed Jun 18 11:33:21 EDT 2008 | slthomas

Dave, can I assume that in the case(s) you're referring to, there was no gas introduced into the evacuation chamber to push any expelled moisture out of the system? In the industry I was involved with (implantable medical devices), we used nitrogen

Prifiling Board life cycle

Electronics Forum | Mon Dec 24 19:12:06 EST 2007 | adamben10

I'm shadowing an old posting posted by Odor back in March 2002. Any Expert out there, if you have good answer to the below questions, please dive in...Thanks in advance. 1) Does anybody have done the profiling board life time experiment? 2) The prof

Wave solder fingers- HELP!

Electronics Forum | Wed Jan 02 15:13:49 EST 2008 | allwave

Hi everybody, I am looking for an alternate source of wave solder fingers for our machines Technical Devices Nu/Era. Does anybody know of some other supplier? I tried the ones from JAFCO but did not perform to our expectations. Any help on this wi

ways to erase/cover IC marking

Electronics Forum | Fri Jan 11 00:32:16 EST 2008 | johnlee9210

Prior to packing the boards, we cover the marking on the IC by dispensing epoxy on top it. This is a way to protect our design so no one can copy it. We have a lot of boards and the optr takes a long time doing it manually. im thinking of using a pne

ways to erase/cover IC marking

Electronics Forum | Mon Jan 14 23:02:52 EST 2008 | davef

You don't mention any particular IC or manufacturer or marking method. However, most IC marking is done with lasers these days. The laser actually alters the encapsulation so the only way to erase the marking is to remove the encapsulation. Otherwise

Solder bridging on one corner of BGA

Electronics Forum | Wed Jan 23 18:15:33 EST 2008 | gsala

Hi, are you dealing with Leaded or Lead Free P-BGA ? soldering by Lead or Lead Free paste ? Any way, some time, bridges can be caused by moisture entrapped in the BGA body. Make sure if is respected the correct MSL's allowed flore exposure time, ot

Stencil Storage Solutions

Electronics Forum | Fri Jan 18 11:20:11 EST 2008 | mulder0990

I was wondering if anyone knew of any good portable stencil solutions. I am looking for a rolling cabinet that can house 20 stencils without a huge footprint. I also need the cart/cabinet to be closed off(doors or otherwise) so customers do not see

Cleaning procedure when WS609 flux is used

Electronics Forum | Fri Jan 18 18:19:38 EST 2008 | arun2382

Is normal DI rinse cycle enough to wash away all residue after SMT assembly of high density substrate? This substrate would later be over molded to form MCM module package and I am seeing delamination in high density areas of the substrate at MSL3

Cleaning procedure when WS609 flux is used

Electronics Forum | Tue Jan 29 13:51:24 EST 2008 | bbarton

Dave F....BOGUS BOGUS BOGUS What compatability issue could there possibly be if the flux is removed during wash???? Why on EARTH would you leave ANY WS flux residue on the board? A recipie for disaster! Beef up the cleaning process, test for contami


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