Electronics Forum | Mon Apr 06 17:31:25 EDT 2009 | miguerre
Hi, We are currently in the process of selecting equipment and I was wondering if you had any comments on your experience with Manncorp. We are looking for Stencil Printers, Reflow Oven, Cleaner (SMT Aqueous Sys), and maybe others. Is this a good b
Electronics Forum | Thu Apr 09 12:27:12 EDT 2009 | devgru
Hi Dominic, By any chance did you look at yestech? I have a couple of their systems and have one dedicated for SPI. A while back, I did look at the CyberOptics SPI system, and while a very good system, I couldn't get the ROI into a range that was goo
Electronics Forum | Fri Apr 10 13:25:08 EDT 2009 | jefflkupkt
Layer 2 is the ground plane layer of a 4 layer board. After installing a 2.5 mm DC power jack and 0.1 center SIP header by hand, the ground pin disconnects and causes an open. My board supplier said they passed Electrical Test. Prepreg was within
Electronics Forum | Tue Apr 14 14:05:07 EDT 2009 | babe7362000
Could anyone tell me why the prewash tank will run for awhile and then the tank will fill and over fill. I am not too aware of the machine and trying to help. It looks like there are 3 different level switches. It looks they work properly for abou
Electronics Forum | Thu Apr 23 21:07:09 EDT 2009 | luismolinero
Emilio: Several factors you need to take into account and your process parameters will depend on: Solder Alloy, Is there any Fine Pitch?; BGA?; Smaller chip size?. Tipically you should go for controls in: Solder Temperature and viscosity; blade and s
Electronics Forum | Tue Apr 28 09:03:30 EDT 2009 | adamconaway
We have recently purchased a CP643, a CP6 and an IP3 in addition to our older fuji equipment. I am in the process of setting up the line descriptor on the MCS30 and I cannot locate the machine_type #'s for any of these machines. Can anyone help me ou
Electronics Forum | Tue Apr 28 03:05:48 EDT 2009 | nibirta
Hi, we are facing a problem with a cobar solder paste and i need some support here. We have 2 lots of solder paste: one makes solder balls, one no-solder balls. Can you suggest me any analyses that we can performed in order to see the differences bet
Electronics Forum | Fri May 01 07:22:56 EDT 2009 | kareal
In my project of flip chip PGA production , I found serious delamination in interface of solder mask and first layer copper trace of substrate after UHAST 96hrs( 130C, 85%RH) reliability test. The delamination are always around one type solder bump,
Electronics Forum | Fri May 22 08:04:30 EDT 2009 | stevezeva
Have any of you ever worked with Actel's QFN 180? A three row I/O QFN? Actel has a published paper on design and assembly guidelines, but we're finding that they are pretty much generic, and don't really work as well as they lead you to believe. ht
Electronics Forum | Sun May 17 00:41:17 EDT 2009 | microdot
hi, I am sorry if i sound offended anybody. What i meant is that we are handling boards which are from major manufacturers like hp / compaq / dell / ibm / intel. So if annybody has experience of handling it..than they may have reflow profiles of sa
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